Flexible package with label chip

Abstract

The invention relates to a flexible package provided with a label chip, the flexible package at least comprises a heat sealing layer and a blocking layer from inside to outside, the blocking layer is the outermost layer of the flexible package, the blocking layer and the heat sealing layer are connected in a stacked mode, and the label chip is arranged between the blocking layer and the heat sealing layer. The thickness of the blocking layer is 40-80 microns, and the thickness of the heat sealing layer is not smaller than 30 microns. And the average pore diameter of the blocking layer is 30-40 nm. And the porosity of the blocking layer is 55-60%. The heat-sealing layer is prepared from the following components: ethylene-propylene copolymer, high-density polyethylene and polyacrylate. The components for preparing the blocking layer comprise high-density polyethylene, poly (propylene-alt-ethylene), poly (butyl acrylate-styrene) and ultra-high molecular weight polyethylene. The blocking layer and the heat sealing layer each have a tensile strength of 100 kgf / cm2 or more. The puncture strength of the blocking layer and the heat sealing layer is 3.0 N or more.

Description

technical field [0001] The invention relates to the field of flexible packaging, in particular to a flexible packaging provided with a label chip. Background technique [0002] UHF radio frequency identification (RFID) technology is a non-contact automatic identification technology. In the radio frequency identification system, the reader sends radio frequency microwave signals to activate the radio frequency tag chip, and receives the radio frequency signal returned from the tag, so as to achieve the purpose of identification. The tag chip can be attached to various items. At present, UHF RFID has been used in various fields, such as wine anti-counterfeiting, clothing, electricity and so on. [0003] The tag chip usually includes an RFID chip and an antenna assembly electrically connected to the RFID chip. The RFID chip contains data (such as the identification code of the product type and / or product component), and the antenna assembly is used to transmit signals to the ...

AI Technical Summary

Problems solved by technology

[0005] At present, the technical problems in the application of ultra-high frequency radio frequency identification (RFID) technology in the field of flexible packaging are: 1. When the label chip is attached to the outside of the flexible packaging through an adhesive, the label chip is easily lost during the transportation of the flexible packaging container, and There is the possibility of man-made disassembly and labeling; 2. Embedding the label chip into the composite film of the flexible packaging can eliminate the risk of the label chip being lost during the transfer and transportation of the goods. Electromagnetic wave reflection, electromagnetic wave energy absorption of the composite film, interference and diffraction of the electromagnetic wave by the composite film, etc., will weaken the signal strength of the label chip, thus resulting in a significant decline in the identification performance and recognition rate of the label chip

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