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Automatic alignment method for bonding pads in coordinate file and Gerber file

An automatic alignment and pad technology, which is applied in the direction of electrical components, circuit board tool positioning, and electrical component assembly of printed circuits, etc., can solve the increase in the complexity of PCB board design, the heavy workload of engineers checking coordinates, and the risk of production quality, etc. problems, to reduce the risk of production quality, improve design efficiency and processing efficiency, and achieve the effect of strong versatility

Pending Publication Date: 2022-01-21
SHENZHEN HUAQIANGJUFENG ELECTRONICS TECH CO LTD
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Problems solved by technology

[0009] However, in recent years, the complexity of PCB board design has also been greatly increased, and the types and quantities of components used are also increasing. In particular, products are increasingly developing in the direction of multi-variety and small batches, and the number of orders for patch factories is increasing. , the workload of engineers to check coordinates is increasing
This traditional mode of checking coordinates is very dependent on the experience of engineers, and it is easy to miss, causing production quality risks

Method used

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  • Automatic alignment method for bonding pads in coordinate file and Gerber file
  • Automatic alignment method for bonding pads in coordinate file and Gerber file
  • Automatic alignment method for bonding pads in coordinate file and Gerber file

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Embodiment Construction

[0060] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0061] It should be noted that all directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present invention are limited to relative positions on the specified view, rather than absolute positions.

[0062] In addition, in the present invention, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explici...

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Abstract

The invention relates to the technical field of SMT (Surface Mount Technology) production and processing, in particular to an automatic alignment method for bonding pads in a coordinate file and a Gerber file. The method comprises the following steps of: S1, preprocessing the Gerber file; S2, creating a virtual component; S3, aligning the virtual component with the coordinate file; S4, performing alignment verification on the coordinate file and the virtual component; and S5, checking and adjusting the coordinates. Compared with the prior art, the automatic alignment method for the bonding pads in the coordinate file and the Gerber file is high in universality, rapid and automatic alignment can be achieved, the design efficiency and the machining efficiency are improved, the production quality is ensured, and the production quality risk is reduced.

Description

【Technical field】 [0001] The invention relates to the technical field of SMT production and processing, in particular to an automatic alignment method for pads in coordinate files and Gerber files. 【Background technique】 [0002] In SMT processing, PCB production Gerber is generally used as the original data, and in the PCB production process, it is possible to perform operations such as SET imposition, resetting the coordinate origin, overall rotation, and overall mirroring of the Gerber file, resulting in the coordinate file when doing SMT. There is an overall transformation with the Gerber file, and SMT engineers need to spend a lot of energy on the overall alignment. [0003] In the PCB design stage, each PCB design engineer has different design habits, and the position of the coordinate origin set when designing the PCB package library is different. Therefore, in the coordinate file exported, the relative position of the coordinate point and the pad may be different. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/34
CPCH05K3/0008H05K3/0005H05K3/34
Inventor 周小飞李祥
Owner SHENZHEN HUAQIANGJUFENG ELECTRONICS TECH CO LTD
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