An integrated circuit lead frame etching solution recovery device

A lead frame and integrated circuit technology, applied in the direction of electrolysis components, electrolysis process, instruments, etc., can solve the problems of limited electrolysis capacity, residue, single treatment method, etc., and achieve the effect of improving the degree of automation, improving the ability of processing, and being convenient to use

Active Publication Date: 2022-06-17
天水华洋电子科技股份有限公司
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  • Claims
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Problems solved by technology

[0004] In the prior art, in the process of recovering the lead frame etching solution, the treatment method is single, and the metal ions are mostly electrolyzed by point solution to process the etching solution, but the electrolysis capacity is limited, which will cause the metal ions to remain. And after the electrolysis is completed, some impurities will remain in the etching solution, and direct recovery will affect the cleanliness of the etching solution and affect the etching performance of the etching solution.

Method used

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  • An integrated circuit lead frame etching solution recovery device
  • An integrated circuit lead frame etching solution recovery device
  • An integrated circuit lead frame etching solution recovery device

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Embodiment approach

[0040] As an embodiment of the present invention, the second liquid discharge mechanism includes a second installation groove 15 and a second through port 16 , the second installation groove 15 is opened inside the second partition plate 4 , and the inner wall of the second installation groove 15 A second sealing plate 17 is slidably sealed on the upper side. A second return spring 18 is fixedly connected between the right end of the second sealing plate 17 and the inner wall of the second installation groove 15. The top of the second sealing plate 17 is provided with a linear array of The second communication groove 19, the second through port 16 is opened in a linear array on the top of the second partition plate 4, the second through port 16 and the second communication groove 19 are arranged in a staggered position, and the right side of the top of the second sealing plate 17 is fixedly connected with a In the second linkage block 20, the top of the second sealing plate 17 ...

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Abstract

The present invention relates to the technical field of etchant recovery, in particular to an etchant recovery device for an integrated circuit lead frame, which includes a recovery tank. A first partition plate, a second partition plate and a filter plate are arranged in sequence from top to bottom, and the interior of the recovery tank is divided into an electrolysis chamber, a neutralization chamber and a filter chamber by the partition board and the filter plate. In the whole recycling process, two treatments are carried out by means of electrolysis and neutralization, which improves the ability to process the etching solution and helps to ensure the purity of the recovered etching solution. After filtering through the filter plate, impurities and neutralization And the sediment is also filtered to make the recovered etching solution more tidy.

Description

technical field [0001] The invention relates to the field of etching solution recovery, in particular to an etching solution recovery device for integrated circuit lead frames. Background technique [0002] In the production of lead frames, etching is a ubiquitous process, which mainly refers to the removal of unwanted metal copper on the circuit board. Under normal circumstances, the etching of circuit boards is a chemical etching process, and the etching solution after etching contains a high concentration of copper ions and other chemicals. In the past, the treatment of these waste liquids was generally handed over to qualified hazardous waste treatment providers for recycling. The method is mainly to extract copper from the etching solution through electrolysis. After electrolysis, a usable copper block and a recyclable etching solution electrolyte are produced. The etching solution electrolyte can improve the recycling effect under the condition of high oxidation. [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/46C25C1/12C25C7/06C25C7/00
CPCC23F1/46C25C1/12C25C7/06C25C7/00Y02P10/20
Inventor 康亮康小明马文龙
Owner 天水华洋电子科技股份有限公司
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