Ball grid array packaging integrated circuit tray

Abstract

The invention belongs to the field of integrated circuits, and discloses a ball grid array packaging integrated circuit tray which comprises a tray body, wherein a plurality of pockets are arranged on the tray body, and each pocket comprises a middle surface, a front surface structure and a back surface structure; each front surface structure comprises a front surface supporting surface, a front surface pocket hole is formed in the front surface supporting surface, a plurality of strip-shaped front surface positioning blocks are arranged on the surface of the front surface supporting surface, and a defining surface extends to the middle surface from the front surface supporting surface; a front surface guiding surface and a front surface positioning surface are arranged on the side surface of each front surface supporting surface; each back surface structure comprises a back surface supporting surface, a back surface pocket hole is formed in the back surface supporting surface, a plurality of back surface positioning blocks are arranged on the surface of the back surface supporting surface, the inner wall of the back surface pocket hole extends to the middle surface, and the side surface of each back surface positioning block has a back surface guiding surface and a back surface positioning surface; and a plurality of back surface positioning blocks can be accommodated in gaps among the plurality of strip-shaped front surface positioning blocks of each pocket. The ball grid array packaging integrated circuit tray has the advantages that solder balls are prevented from being damaged, falling off and contaminated in the testing, transporting and using processes of a BGA integrated circuit.

Description

technical field [0001] The invention belongs to the field of packaging materials for integrated circuits, and relates to a packaging tray for ball grid array packaging integrated circuits. Background technique [0002] Ball Grid Array (BGA) technology is a high-density packaging technology applied to surface mount integrated circuits. It is one of the best packaging forms for high-density, high-performance, multi-pin integrated circuits such as CPUs. . The BGA package can accommodate more pins than other packages such as dual-in-line packages or four-sided pin flat packages. High, low energy consumption and other characteristics. [0003] The BGA packaging technology is improved from the pin grid array. When packaging, a certain surface is covered (or partially covered) with solder balls in a grid arrangement. The solder balls are used as pins to connect the integrated circuit and the printed circuit board. electric signal. Its structural feature is that the solder balls...

AI Technical Summary

Problems solved by technology

Its structural feature is that the solder balls are raised and arranged on the substrate to form an array, and foreign objects are easily caught in the gaps of the solder balls inside the array; the solder balls arranged on the edges and four corners are easy to be damaged or fall off because they are not protected by the surrounding solder balls

[0004] When the tray is used as a loading tool for BGA integrated circuits, the solder balls are in direct contact with the bottom surface of the pocket of the tray, and are easily scratched, peeled off, and stained during testing, transportation, and use, resulting in circuit damage

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