Method and device for determining improvement sequence of machine working procedures, and machining system

Abstract

The invention provides a method and device for determining the improvement sequence of machine working procedures, and a machining system. The method comprises the steps: detecting the consumed time of each working procedure when a target machine is used for machining a plurality of wafer groups in a first preset time, and obtaining a plurality of groups of machining time, wherein the wafer group is one or more wafers in a wafer box, and one group of processing time comprises the processing time of each procedure corresponding to one wafer group; determining the shortest processing time of each procedure according to the plurality of groups of processing time; calculating the difference values between the multiple machining times corresponding to the working procedures and the corresponding shortest machining time, obtaining multiple first difference values, calculating the average value of the multiple first difference values, and obtaining first average exceeding time, wherein each set of machining time comprises one machining time corresponding to the working procedure; and determining an improvement sequence of the plurality of processes according to the first average exceeding time of each process. According to the method, the problem that the influence degree of each working procedure of machine processing on the working efficiency is difficult to judge in the prior art is solved.

Description

technical field [0001] The present application relates to the field of machine technology, and in particular, relates to a method for determining an improvement sequence of a machine process, a determining device, a computer-readable storage medium, a processor, and a processing system. Background technique [0002] In the semiconductor manufacturing process, for a small machine, the processing unit is a wafer, that is, a single wafer; for a non-small machine, the processing unit is a lot, and a lot is a plurality of wafers in a wafer cassette, and the processing unit is recorded as Ceil, that is, wafer group, ceil is the most basic processing unit of the machine, which can be lot or wafer. Each ceil goes through multiple processes in the machine. In the prior art, engineers can only observe the ceil of a certain wafer group in different processes. Judging which process has the problem of slow transmission or processing based on the residence time of the process, inferring p...

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Problems solved by technology

[0004] The main purpose of this application is to provide a method for determining the order of improvement of the machine process, a determining device, a computer-readable storage medium, a processor, and a processing system, so as to solve the problem that it is difficult to judge the process of machine processing in the prior art. The question of the degree of impact on efficiency

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