Semiconductor gantry pick-up module

Abstract

The invention discloses a semiconductor gantry pick-up module, and aims to provide a semiconductor gantry pick-up module which is quick in-place pick-up, simple in structure and high in compatibility. The module comprises a transferring mechanism and a picking mechanism. The transferring mechanism drives the picking mechanism to do reciprocating motion, the picking mechanism comprises a bottom plate vacuum adsorption assembly, a pressing assembly, a transmission assembly and a plurality of sets of picking units, the bottom plate is connected with the transferring mechanism, and the two sides of the bottom plate are each provided with two sets of side plates; the vacuum adsorption assembly is arranged on the bottom plate and correspondingly matched with the multiple sets of picking units, the pressing assembly, the transmission assembly and the multiple sets of picking units are all connected with the side plate, the pressing assembly is arranged on the middle section of the side plate, and the transmission assembly is connected with the pressing assembly in a matched mode and correspondingly drives the multiple sets of picking units to conduct picking action. The module is applied to the technical field of rapid taking and placing modules for semiconductors.

Description

technical field [0001] The invention relates to the technical field of semiconductor fast pick-and-place modules, in particular to a semiconductor gantry pick-up module. Background technique [0002] In the manufacturing process of semiconductor special equipment, it is a key technology to realize the automatic pick-up, placement and automatic transfer of semiconductor IC packages. Common grabbing devices adopt clamping and adsorption types. The clamping grabbing structure is suitable for large-scale grabbing operations, but it is easy to cause damage to IC packages; , It is necessary to use a large-scale pickup module corresponding to the IC package, and uniformly pick up the pick-up, which cannot be picked up one by one, and the compatibility is low and it is difficult to apply to a variety of different products. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art, and provide a ...

AI Technical Summary

Problems solved by technology

Common grabbing devices adopt clamping and adsorption types. The clamping grabbing structure is suitable for large-scale grabbing operations, but it is easy to cause damage to IC packages; the absorbing grabbing structure is more complicated, and when picking up a large number of IC packages , it is necessary to use a large pickup module corresponding to the IC package, and it can be picked up uniformly. It cannot be picked up one by one, and the compatibility is low, so it is difficult to apply to a variety of different products.

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