Display panel, display backboard and manufacturing method thereof
A display backplane and manufacturing method technology, applied to semiconductor devices, electrical components, circuits, etc., can solve the problem of reducing the width of the display panel frame
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example 1
[0078] Example 1: see Figure 2-4 As shown, one end of the second wire layer 12 also extends to the side (the side is the side where the corresponding first wire layer extends) and is flush with the side, the second wire layer 12 extends to one end of the side, and binds The inner surface of the fixed layer 13 is attached; and the lower end 132 of the binding layer 13 (the lower end 132 is the end of the binding layer away from the top surface of the base substrate 1) can be flush with the second wire layer 12 (that is, the lower end 132 The end face is located on the same surface as the lower surface of the second wire layer 12 (the lower surface is the surface away from the bottom surface of the base substrate 1), or may not be flush with the second wire layer 12, which can be flexibly set according to requirements.
example 2
[0079] Example 2: see Figure 2-2As shown, the lower end 132 of the binding layer 13 extends to the bottom surface, and is superimposed on the corresponding second wire layer 12, and the electrical connection is realized in this way of superimposing up and down (that is, overlapping), which can improve the connection between the two. contact area and the reliability of the connection. In this example, the second wire layer 12 may not extend to the side of the base substrate 1, Figure 2-2 In the example shown, the second wire layer 12 extends to the side of the base substrate 1 . Of course, in some other application examples, the second wire layer 12 may not extend to the side of the base substrate 1, for example, see diagram 2-1 As shown, at this time, the second wire layer 12 extends to one end of the side surface, and can also be attached to the inner surface of the binding layer 13 at the same time, thereby further increasing the contact area between the two. That is t...
example 3
[0080] Example three: see Figure 2-3 As shown, this example is the same as in Example 2 Figure 2-2 The difference of the connection structure shown is that the lower end 132 of the binding layer 13 extends to the bottom surface, and is in contact with the corresponding end surface of the second wire layer 12 .
[0081] Of course, the connection structure between the bonding layer and the second wire layer is not limited to the structures shown in the above examples, and can be flexibly replaced with other structures, which will not be repeated here.
[0082] In an example of this example, in order to avoid the problem of disconnection when the bonding layer extends to the bottom surface of the base substrate, at least one side of the base substrate (for example, the side to which the first wiring layer extends) and The area where the bottom surfaces intersect is set as a chamfered area or a rounded area, and the lower end of the binding layer extends to the bottom surface a...
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