Plasma cleaning protection device and method for rigid-flex board

Abstract

The invention discloses and provides a plasma cleaning protection device and method for a rigid-flex board, which can well protect the rigid-flex board and prevent the rigid-flex board from being damaged during plasma cleaning. The device comprises two base boards, wherein through hole areas are arranged on the base boards, baffles matched with a flexible board are arranged in the through hole areas, the two ends of each baffle are connected to the hole walls of the through hole areas, a plurality of positioning holes are formed in the base boards and surround the through hole areas, hollow rivets are arranged on the positioning holes in one base board, and a hollow rivet penetrates through the positioning hole in the other base board so as to arrange the two base boards in an overlapped mode. According to the invention, the rigid-flex board is located between the two base boards in the using process, the rigid board of the rigid-flex board is exposed outside through the through hole area, and the flexible board of the rigid-flex board is completely clamped by the baffles on the two base boards; and the plasma cleaning protection device is applied to the technical field of PCB / FPC production.

Description

technical field [0001] The invention relates to the technical field of PCB / FPC production, in particular to a plasma cleaning protection device and method for a soft-hard combination board. Background technique [0002] With the development of electronic products towards high density, miniaturization, and high reliability, flexible circuit boards (FPC) with free bending, winding, and folding characteristics have attracted attention. The development of flexible circuit boards and PCB hard boards has given birth to a new product of soft and hard boards. "The so-called rigid-flex board is a flexible circuit board and a rigid circuit board. After lamination and other processes, they are combined together according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. When producing rigid-flex boards, There is no adhesive layer in the soft board area, which is prone to foaming and will be scrapped later. There is also a ve...

AI Technical Summary

Problems solved by technology

When producing soft-rigid boards, there is no adhesive layer in the soft board area, which is prone to foaming and will be scrapped later, and there is a very important process, which is to clean the hole wall after drilling, whether it is mechanical drilling or laser Drilling needs to be used, and the process that is often used to clean the hole wall is plasma cleaning. When the soft board area is large, plasma cleaning will often lead to bubbling, deformation, and burning of the soft board area. series of questions

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