Semiconductor refrigeration chip test tool

[0004] In practical applications, it is necessary to select different semiconductor cooling chips for different use environments and equipment. However, there are currently no relevant instrument test data for reference in the selection of semiconductor cooling chips, such as ceramic cooling chips, in the market. It can...

Further, the semiconductor cooling chip test tooling 100 also includes a first heat conduction block 113 and a second heat conduction block 115, the first heat conduction block 113 and the second heat conduction block 115 are respectively arranged on both sides of the refrigeration chip 110, and the heat dissipation module The bottom of 150 is provided with a fixed cover 151 , the first heat conduction block 113 is embedded in the fix cover 151 , and is opposed to the heat dissipation module 150 , and the second heat conduction block 115 is attached to the heating module 130 . Specifically, both the first heat conduction block 113 and the second heat conduction block 115 are copper blocks with excellent thermal conductivity, wherein the first heat conduction block 113 is bonded to the lower surface of the heat dissipation module 150 through heat conduction silicone grease, and the second heat conduction block 115 is pasted on the surface of the ceramic heating chip 133 through thermal conductive silicone grease. The fixing cover 151 is made of bakelite board, which can play the role of fixing the first heat conducting block 113 .

In summary, the semiconductor refrigeration chip test tooling 100 and test method provided in the present embodiment, by setting the cooling module 150 on the hot surface of the refrigeration chip 110, setting the heating module 130 on the cold surface of the refrigeration chip 110, by heating The module 130 heats the cooling chip 110 with different heating powers, and then uses the temperature measurement module 170 to measure the steady-state cooling temperature of the cooling chip 110 under different heating powers, wherein the steady-state cooling temperature is used to characterize the performance of the cooling chip 110 . In this embodiment, the heating module 130 is installed, and the steady-state refrigeration temperature under different power conditions is recorded by using the power variation of the heating module 130, so as to complete the chip performance test and select the cooling chip 110 that best matches each product. model, so as to maximize the performance of the cooling chip 110. And, by setting the limit module 190 on the positioning frame 180, then setting the heating module 130 on the limit module 190, and then detachably connecting the heat dissipation module 150 on the positioning frame 180, wherein the cooling chip 110 is placed on the heating module 130, while the heat dissipation module 150 is used to press-fit the cooling chip 110, and press the cooling chip 110, the heating module 130 and the limiting module 190 into one body, thereby realizing the fixing of the cooling chip 110. When the cooling c...