Method for preventing golden finger from being scratched during detection of electronic component
A technology for electronic components and gold fingers, applied in the field of electronic component circuit detection, can solve problems such as detection efficiency of easily damaged gold fingers, and achieve the effects of reducing detection costs, simplifying steps, and ensuring accuracy
Pending Publication Date: 2022-02-25
深圳达沃斯光电有限公司
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[0003] The present invention intends to provide a method for preventing gold fingers from being scratched when detecting electronic components, which solves the problems in the prior art that the gold fingers on the main board are easily damaged and the detection efficiency is low when detecting electronic components
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Embodiment 2
[0038] The difference between this embodiment and Embodiment 1 is that in this embodiment, a preparatory step is also included, and the preparatory step is before step S1, and the preparatory step also includes the following steps:
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The invention belongs to the technical field of circuit detection of electronic components, and discloses a method for preventing a golden finger from being scratched during detection of an electronic component. The method comprises the steps of S1, adding an auxiliary test block beside a position where the golden finger is printed on a mainboard; S2, printing a golden finger on a circuit of the mainboard and the auxiliary test block; S3, testing the golden finger of the auxiliary test block by using a probe; and S4, cutting off the auxiliary test block from the mainboard. The problems that the golden finger on the mainboard is easy to damage and the detection efficiency is low when the electronic component is detected in the prior art are solved.
Description
technical field [0001] The invention belongs to the field of circuit detection of electronic components, and in particular relates to a method for preventing golden fingers from being scratched during detection of electronic components. Background technique [0002] When the electronic components leave the factory, the circuit needs to be tested to check whether the electronic components can be powered on normally. There are two detection methods in the existing technology: ① use probe to test; ② use FPC false pressure test; if use probe to test, since the recovery of the probe will gradually weaken after a long time of use, it is necessary to press the probe hard during the test. Accurate testing can only be done after the probe is fully in contact with the material; during testing, personnel operate and press the probe, if the probe moves, it will scratch or break the gold finger on the main board, causing the gold finger damage; when using FPC testing, it is necessary to...
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IPC IPC(8): G01R31/28G01R1/02H05K1/11
CPCG01R31/2832G01R1/02H05K1/11
Inventor 李振兴吴煜
Owner 深圳达沃斯光电有限公司