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Flaky piezoelectric ceramic extrusion injection valve

A technology of piezoelectric ceramics and injection valves, which is applied in the direction of circuits, electrical components, coatings, etc., can solve the problems of slow dispensing frequency, large glue volume, and low precision, and achieve breakthrough glue volume, meet process requirements, and high point glue frequency effect

Inactive Publication Date: 2022-03-04
深圳市轴心压电技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a sheet-shaped piezoelectric ceramic extrusion injection valve, which has higher dispensing frequency, smaller glue volume, and output of dot diameter. , broke through the limit capability of conventional dispensing valves, can meet the more miniaturized and refined semiconductor packaging process, and solve the problems of slow dispensing frequency, large glue volume, low precision, single-point injection glue volume and The problem that the point diameter is difficult to break through the lower limit

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  • Flaky piezoelectric ceramic extrusion injection valve
  • Flaky piezoelectric ceramic extrusion injection valve
  • Flaky piezoelectric ceramic extrusion injection valve

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Embodiment Construction

[0023] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention. In addition, all the connection / connection relationships involved in the patent do not simply refer to the direct connection of components, but mean that a better connection structure can be formed by adding or reducing connection accessories according to specific implementation conditions. The various technical features in the invention can be combined interactively on the premise of not conflictin...

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Abstract

The invention discloses a flaky piezoelectric ceramic extrusion injection valve which comprises an upper valve body, a flow channel, a lower valve body, flaky piezoelectric ceramic, a metal diaphragm and a nozzle, a protruding structure is arranged at the bottom end of the hollow upper valve body, a through hole is formed in the bottom end of the lower valve body of a cavity structure, and the nozzle is arranged in the through hole. The sheet-shaped piezoelectric ceramic and the metal diaphragm are arranged in the cavity of the lower valve body, the upper end face of the sheet-shaped piezoelectric ceramic is in contact and fixed with the protruding structure of the upper valve body, the lower end of the sheet-shaped piezoelectric ceramic is in contact and fixed with the upper end of the metal diaphragm, and the lower end of the metal diaphragm is connected with the bottom of the cavity of the lower valve body. A lower valve body inner cavity is formed by the bottom of the lower valve body cavity of the arc-shaped mechanism and the metal diaphragm, the lower end of the lower valve body inner cavity is communicated with the nozzle, and after electrification, the sheet-shaped piezoelectric ceramic generates tiny deformation to extrude glue in the lower valve body inner cavity. The dispensing valve breaks through the limit of the glue amount and the dispensing diameter of an existing dispensing valve, has higher dispensing frequency and can be suitable for smaller and finer semiconductor packaging.

Description

technical field [0001] The invention relates to the technical field of injection valves, in particular to a sheet piezoelectric ceramic extrusion injection valve. Background technique [0002] In recent years, the semiconductor industry has entered a period of rapid development. Important processes such as placement, encapsulation, and underfill in semiconductor packaging require the support of fluid dispensing technology to achieve accurate and stable microfluid distribution. With the continuous development of ultra-fine micromachining technology, the volume of precision components is becoming smaller and smaller. At the same time, the requirements for micro-assembly and connection packaging technology of these precision components are also getting higher and higher. Micro-injection technology is a product in the micro-assembly system. One of the main assembly methods, so micro-injection technology plays a key role in the development of semiconductors, microelectronic packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02H01L21/56
CPCB05C5/0225H01L21/56
Inventor 黄金仁陈坚
Owner 深圳市轴心压电技术有限公司