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Glue-removing soaking material box for semiconductor packaging product

A semiconductor and material box technology, which is applied in the manufacture of semiconductor/solid-state devices, cleaning methods using liquids, electrical components, etc., can solve the problems of poor glue removal and cleaning effect, residual liquid medicine, and excessive consumption of liquid medicine, so as to save liquid medicine. , Improve fluidity and improve the effect of removing glue

Pending Publication Date: 2022-03-04
FOSHAN BLUE ROCKET ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Different from traditional electronic packaging products, new electronic packaging products such as QFN and DFN have very flat surfaces and are very thin. 70 ~ 100mm, thickness 0.3 ~ 1.0mm, this new type of electronic packaging products are superimposed and placed in the charging box of the utility model patent No. 201620540169. The cleaning effect is poor, and it consumes a lot of potions
In addition, if the above-mentioned new electronic packaging products are stacked together for cleaning, it is easy to cause scratches on the surface of the plastic package and produce watermarks, which will affect the technical effect of the product when it is tinned (traditional electronic packaging products, because there are no QFN, DFN, etc. The surface of new electronic packaging products is fine, so there is usually no need to worry about scratches on the surface of the package when superimposed cleaning)
In addition, the charging box in the utility model patent No. 201620540169.0 still has the problem of liquid medicine residue to a certain extent

Method used

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  • Glue-removing soaking material box for semiconductor packaging product
  • Glue-removing soaking material box for semiconductor packaging product
  • Glue-removing soaking material box for semiconductor packaging product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 2 and combine image 3 , Figure 4 , Figure 5 As shown, a glue-removing soaking box 1 for semiconductor packaging products includes a box surrounded by an upper side plate 101, a lower side plate 102, a left side plate 103, a right side plate 104 and a bottom plate 106, and the overall shape is a cube or The magazine body of cuboid also comprises cover plate 105, and one side of cover plate 105 is hingedly connected with right side plate 104 by hinge 1010, and rotating cover plate 105 can make cover plate 105 open or cover on the magazine body, The upper side plate 101, the lower side plate 102, the left side plate 103, the right side plate 104, the cover plate 105 and the bottom plate 106 are all provided with water-permeable structures; the bottom plate 106 is also provided with a separation and positioning device for semiconductor packaging products, and the upper side plate The middle part of 101 is also provided with handle 1011.

[0040]It sho...

Embodiment 2

[0045] The basic shape and structure of this embodiment are the same as those of Embodiment 1, the difference is that, as Figure 7 As shown, in this embodiment, the upper side plate, the lower side plate (not shown in the figure), the left side plate, the right side plate (not shown in the figure), the bottom plate ( (not shown in the figure) and the cover plate are both criss-crossed and combined screen plates made of stainless steel wires, and the meshes of the screen plates constitute the permeable structure. In addition, whether it is this embodiment or embodiment 1, parallel barriers can be set on the bottom plate to separate and position the semiconductor packaging products to be deglue-treated. Of course, in terms of product processing and use, two rows The technical scheme in which the stainless steel rake teeth 1012 are used as the separation positioning device is more optimal.

[0046] Above, the shape and structural features of the two embodiments of the present i...

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Abstract

The invention provides a degumming soaking material box for semiconductor packaging products, which comprises a material box body which is enclosed by an upper side plate, a lower side plate, a left side plate, a right side plate and a bottom plate and is in a cube or cuboid overall shape, and further comprises a cover plate, one side of the cover plate is hinged with the right side plate, and the cover plate can be opened or covered on the material box body by rotating the cover plate; permeable structures are arranged on the upper side plate, the lower side plate, the left side plate, the right side plate, the cover plate and the bottom plate; and the bottom plate is also provided with a separating and positioning device for semiconductor packaging products. The device and the method are not only suitable for degumming treatment of traditional electronic packaging products, but also suitable for degumming treatment of novel electronic packaging products such as QFN and DFN, not only effectively solve the problem that the surfaces of novel packaging bodies are prone to being scratched or generate liquid medicine marks in the degumming process, but also remarkably improve the degumming efficiency and save liquid medicine.

Description

technical field [0001] The invention belongs to the technical field of manufacturing equipment for degumming the package appearance of semiconductor electronic devices, and in particular relates to a degumming and soaking material box for semiconductor packaging products. Background technique [0002] The utility model patent with application number 201620540169.0 discloses a semiconductor electronic device packaging appearance degumming equipment including a flying rake feeding rack, a charging box (degumming and soaking box), a medicine cooking tank and two fans located above the opening of the medicine cooking tank. The lid of the medicine tank, the flying rake feeding frame is provided with a space for placing the charging box, the number of the space is 2 to 6, and the number, shape and size of the charging box are the same as those of the charging box. The number, shape and size of the spaces match. At present, this utility model patent is still used in production pra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/04B08B3/08B08B13/00H01L21/67
CPCB08B3/047B08B3/08B08B13/00H01L21/67126
Inventor 陈耀锋邱焕枢莫玉成曾志坚
Owner FOSHAN BLUE ROCKET ELECTRONICS
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