Production formula and processing technology of electronic insulating film
An insulating film and production formula technology, applied in the field of chemical materials, can solve the problems of insufficient quality strength, reduced insulating strength, hidden safety hazards, etc., and achieve the effects of high quality strength, good insulating effect, and avoiding equipment damage.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0021] Embodiment 1: the present invention provides a kind of technical scheme:
[0022] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.
[0023] The weight ratio of the base layer of the organic insulating film, the reinforced connection structure, the inorganic insulator on the outside and the additive is 35 parts by weight of the base layer of the organic insulating film, 6 parts by weight of the reinforced connection structure, 55 parts by weight of the inorga...
Embodiment 2
[0030] Embodiment 2: the present invention provides a kind of technical scheme:
[0031] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.
[0032] The weight ratio of the base layer of the organic insulating film, the reinforced connection structure, the inorganic insulator on the outside and the additive is 45 parts by weight of the base layer of the organic insulating film, 8 parts by weight of the reinforced connection structure, 45 parts by weight of the inorga...
Embodiment 3
[0039] Embodiment 3: the present invention provides a kind of technical scheme:
[0040] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.
[0041] The weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is 55 parts by weight of the organic insulating film base layer, 10 parts by weight of the reinforced connection structure, 35 parts by weight of the outer inorganic insulator an...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com