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Production formula and processing technology of electronic insulating film

An insulating film and production formula technology, applied in the field of chemical materials, can solve the problems of insufficient quality strength, reduced insulating strength, hidden safety hazards, etc., and achieve the effects of high quality strength, good insulating effect, and avoiding equipment damage.

Pending Publication Date: 2022-03-08
苏州东达电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the insulating films for electronics currently on the market are relatively simple in design, and most of them can only satisfy the basic insulating effect, but their overall quality and strength are not enough, which may cause structural damage or decrease in insulating strength when they are affected by other external influences. Furthermore, the effect of insulation cannot be better realized, so there are certain safety hazards, etc. Therefore, in view of the above problems, a production formula and processing technology of insulating film for electronics are proposed

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: the present invention provides a kind of technical scheme:

[0022] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.

[0023] The weight ratio of the base layer of the organic insulating film, the reinforced connection structure, the inorganic insulator on the outside and the additive is 35 parts by weight of the base layer of the organic insulating film, 6 parts by weight of the reinforced connection structure, 55 parts by weight of the inorga...

Embodiment 2

[0030] Embodiment 2: the present invention provides a kind of technical scheme:

[0031] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.

[0032] The weight ratio of the base layer of the organic insulating film, the reinforced connection structure, the inorganic insulator on the outside and the additive is 45 parts by weight of the base layer of the organic insulating film, 8 parts by weight of the reinforced connection structure, 45 parts by weight of the inorga...

Embodiment 3

[0039] Embodiment 3: the present invention provides a kind of technical scheme:

[0040] A production formula for an insulating film for electronics, comprising an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and additives, and the weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is organic 35-55 parts by weight of the base layer of the insulating film, 6-10 parts by weight of the reinforced connection structure, 35-55 parts by weight of the inorganic insulator outside and 1-3 parts by weight of the additive.

[0041] The weight ratio of the organic insulating film base layer, the reinforced connection structure, the outer inorganic insulator and the additive is 55 parts by weight of the organic insulating film base layer, 10 parts by weight of the reinforced connection structure, 35 parts by weight of the outer inorganic insulator an...

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PUM

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Abstract

The invention relates to the technical field of chemical materials, in particular to a production formula and processing technology of an electronic insulating film, which comprises an organic insulating film base layer, a reinforced connection structure, an outer inorganic insulator and an additive, the organic insulating film base layer, the reinforced connection structure, the inorganic insulator on the outer side and the additive are prepared from the following components in parts by weight: 35-55 parts of the organic insulating film base layer, 6-10 parts of the reinforced connection structure, 35-55 parts of the inorganic insulator on the outer side and 1-3 parts of the additive. Flatly laying the organic insulating film base layer on a workbench, and fixing the outer side of the organic insulating film; the reinforcing connection structure is mounted on the upper side of the organic insulating film base layer, and according to the technical scheme, the insulating film with high quality and strength and good insulating effect can be produced, so that the use of electronic equipment can be better met, and equipment damage caused by the insulation problem is avoided.

Description

technical field [0001] The invention relates to the technical field of chemical materials, in particular to a production formula and processing technology of an insulating film for electronics. Background technique [0002] With the development of science and technology, people's requirements for the quality of life are getting higher and higher. More and more electronic products have entered people's lives, and there will be some electronic components inside electronic products. Electronic components are the basic components of electronic circuits. Elements are usually individually packaged and have two or more leads or metal contacts. Electronic components must be connected to each other to form an electronic circuit with specific functions. When electronic components are used, insulating films need to be used for isolation. Ensure the stability of its use. [0003] Most of the insulating films for electronics currently on the market are relatively simple in design, and m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C09D183/04C09D7/61C08J7/046
CPCC08J7/0427C08J7/046C08J2323/06C08J2483/04C08K3/36C08K3/34
Inventor 黄育祥
Owner 苏州东达电子材料有限公司
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