Die gap detection equipment
A technology for testing equipment and molds, which is applied in the field of mold gap testing equipment, can solve the problems of increasing the workload of operators, increasing labor costs, and low testing efficiency, achieving the effects of saving labor costs, reducing workload, and high testing accuracy
Pending Publication Date: 2022-03-15
SUZHOU BOZHON ROBOT CO LTD
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Problems solved by technology
[0003] In the prior art, the gap between the upper carrier and the lower carrier is usually measured manually by using various measuring rulers. However, this method will increase the workload of the operator, greatly increase the labor cost, and the detection efficiency is relatively low. low, seriously affecting yield
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[0041] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.
[0042] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two ...
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The invention relates to the technical field of electronic product processing, and discloses mold gap detection equipment. The mold gap detection equipment comprises a detection bearing part and a detection part, the detection bearing part is configured to bear a to-be-detected mold, the to-be-detected mold comprises an upper carrier and a lower carrier which are buckled with each other, and the upper carrier is located above the lower carrier; the detection part comprises a detection frame, an upper laser detection assembly, a lower laser detection assembly and a pressing assembly, and the detection frame is located on one side of the detection bearing part; the upper laser detection assembly and the lower laser detection assembly are arranged on the detection frame at intervals in the vertical direction, the upper laser detection assembly can emit laser to the upper surface of the upper carrier on the detection bearing part, and the lower laser detection assembly can emit laser to the lower surface of the lower carrier on the detection bearing part; the pressing assembly is arranged on the detection frame and is configured to be capable of pressing the upper carrier so that the upper carrier can be attached to the lower carrier. The mold gap detection equipment can save labor cost and is high in detection precision.
Description
technical field [0001] The invention relates to the technical field of electronic product processing, in particular to a mold gap detection device. Background technique [0002] The injection molding process is a process in which thermoplastics or thermosetting materials are made into various shapes of plastic products using plastic molding molds. Many existing electronic product shells are formed by injection molding process. During production, injection molds are usually required. The injection mold includes upper and lower carriers that can be buckled up and down to form an injection cavity. In order to ensure the quality of injection molding, the injection mold is Previously, it was necessary to detect the gap between the snapped upper and lower carriers. [0003] In the prior art, the gap between the upper carrier and the lower carrier is usually measured manually by using various measuring rulers. However, this method will increase the workload of the operator, greatl...
Claims
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IPC IPC(8): B29C45/80
CPCB29C45/80B29C2945/761B29C2945/76461
Inventor 张光宇吕鹏达张玉蔚
Owner SUZHOU BOZHON ROBOT CO LTD