Open type test head of wafer automatic test system

Abstract

An open type testing head of a wafer automatic testing system is assisted by a fixing support, a spring needle interface module and an instrument case are arranged above a wafer automatic probe station, the wafer automatic testing system without a cabinet is rapidly constructed, the weight and the size of the wafer automatic testing system can be reduced, the workshop space is saved, and the cost is reduced. And the instrument case can be electrically connected with the spring needle interface module at a short distance, so that the length of the test signal line can be shortened, and the performance of the test instrument can be improved. The open-type test head can get rid of the constraint of a casing of a known closed-type test head, improves the heat dissipation of an automatic test system, can reduce the research and development cost of the wafer automatic test system, and is easier to carry out the hardware maintenance and function expansion and upgrade of the automatic test system.

Description

technical field [0001] The present invention is an open test head of an automatic wafer test system. With the assistance of a fixed bracket, the pogo pin interface module and the instrument case are placed above the automatic wafer probe station, and in an open combination, Quickly constructing a wafer automatic test system without a cabinet can not only speed up the development speed of the wafer automatic test system, reduce the research and development cost, but also reduce the footprint of the wafer automatic test system and improve the space utilization efficiency of the factory building. Background technique [0002] With the continuous advancement of semiconductor and optoelectronic industry technology, the number of components in the product circuit is increasing. In the field of testing and analysis of component parameters or reliability in the semiconductor or optoelectronic industry, it is necessary to obtain a larger amount of test data for more accurate testing. ...

AI Technical Summary

Problems solved by technology

The test hardware resources used by this "closed test head" are usually special hardware developed exclusively by the original factory, so it is easy to become a closed and solidified system, and must be subject to the constraints of the closed test head casing 701 , so the "closed test head" tends to lack the flexibility of upgrade and expansion, and the cost and price are high

In addition, since all test hardware resources are almost all put into a closed casing, it is necessary to try to solve the heat dissipation problem of a large amount of hardware gathered in the test head casing 701, so a powerful cooling fan needs to be added, but this is easy. Cause noise vibration and energy consumption, and even need to use expensive and complicated water-cooled heat dissipation, causing more troubles and inconveniences

[0004] refer to Figure 14 , another commonly used automatic wafer test is an "instrument cabinet", which can be equipped with instruments and equipment of various brands inside an instrument cabinet 711, and the instruments and equipment are electrically connected to a wafer automatic probe station 71 above Pogo pin interface 72, this "instrument cabinet" has good combination flexibility and expansion and upgrade capabilities, and its open structure also makes hardware equipment easier to adjust and maintain, but its disadvantage is that the instrument cabinet 711 takes up a lot of space , and usually have to pass through very long signal lines, for example: the total length of the signal line even needs 4 to 5 meters to be able to electrically connect to the wafer DUT, thus causing some limitations in test performance

Although some instrument manufacturers have developed miniaturized and modularized instruments and equipment, such as: PXI modular instruments, which can place more instruments and equipment in the instrument cabinet to improve space efficiency; but still must face the electrical connection The typical problem is that the signal line to the wafer DUT is too long

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