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Semiconductor chip image acquisition system

A technology of image acquisition system and image acquisition card, which is applied in the direction of image communication, TV system components, TV, etc. It can solve the problems of no laser drive interface and inability to drive external lasers, etc., and achieve the effect of programmable drive frequency

Pending Publication Date: 2022-03-25
深钛智能科技(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] No laser driver interface, unable to drive external laser

Method used

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  • Semiconductor chip image acquisition system
  • Semiconductor chip image acquisition system
  • Semiconductor chip image acquisition system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0055] For the frame design of the whole system, FPGA configures VCSEL driver through SPI / IO / LVDS, sends out DC / modulated light, and then collects image data through MIPI / LVDS / DVP interface, passes through FPGA internal cache, DDR cache on ICLD board, and finally passes through 10 Gigabit optical fiber network, with PCIE interface, sent to the host workstation.

[0056] The specific image data flow is described as follows:

[0057] 1. The image input signal of MIPI / LVDS / DVP is cached by FPGA internal SRAM

[0058] 2. Keep the image data through DDR memory

[0059] 3. Through the FPGA control, the image data can be read out and sent to the data channel, and the data channel is realized by the 10 Gigabit Ethernet solution

[0060] 4. 4 channels of data are connected to 4 optical ports to PCIE boards through optical fibers, and the boards are connected to the upper workstation;

[0061] The image transmission speed is explained as follows:

[0062] The image transmission spee...

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Abstract

The invention discloses a semiconductor chip image acquisition system. Comprising an image acquisition card, two PPMU daughter boards and a PCIE board, the image acquisition card takes XCKU5P-2FFVD900I in a KintexUltraScale + series of XILINX as a core, and is used for caching data of an external MIPI / LVDS / DVP to a DDR4 and then forwarding the data to an SFP + optical port; two XCKU5P-2FFVD900IFPGAs are used for converting four paths of MIPI / LVDS / DVP into four paths of SFP + optical ports, the four paths of SFP + optical ports are transmitted to a PCIE card through optical fibers, the PCIE card can forward data received in the four paths of SFP + to a PCIE interface, and finally the data are sent to a PC machine for a user to use in real time. The system further comprises three xilinx XC7A15T-CSG324-2 series FPGA chips, two of the FPGA chips are used for controlling the two PPMU modules respectively, and the other FPGA chip is specially used for controlling the switching from the MIPI / LVDS / DVP interface to the PPMU interface.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a semiconductor chip image acquisition system. Background technique [0002] With the development of semiconductor technology, the resolution of high-speed image chips (such as tof chips and cmos image chips) is getting higher and higher, and the interface has also begun to be customized, and due to the demand for production capacity, multiple chips are required to collect in parallel, which further increases It makes image acquisition more difficult. The main pain points and difficulties in the current market: [0003] The interface can not meet, MIPI / LVDS / DVP three kinds of interface, or customer-defined LVDS interface; [0004] The speed requirement is not up to (4.8Gbps), currently, except for a few imported equipment, it is basically impossible in China; [0005] No PPMU unit (requires a PPMU unit for open and short test of chip image pins); [0006] N...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/14H04N5/765
CPCH04N5/14H04N5/765
Inventor 王丽国冯龙柴国占
Owner 深钛智能科技(苏州)有限公司