Wafer loading and unloading system and loading and unloading method

Abstract

The embodiment of the invention discloses a wafer feeding and discharging system and a wafer feeding and discharging method. The wafer feeding and discharging system comprises a feeding buffer area, a polishing buffer area and a feeding buffer area, wherein the feeding buffer area can temporarily store a plurality of wafers to be polished; the blanking buffer area can temporarily store a plurality of polished wafers; the swinging mechanical arm is used for simultaneously transferring the plurality of wafers to be polished, which are temporarily stored in the feeding buffer area, into the corresponding carriers; and the multiple polished wafers in each carrier are transferred to the discharging cache region at the same time.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of semiconductors, and in particular to a wafer loading and unloading system and a loading and unloading method. Background technique [0002] At present, in the automatic loading and unloading system of wafer double-sided polishing equipment, the unloading buffer area is fixed, and a separate mechanical arm needs to be added to transfer the polished wafers in the unloading buffer area to the wafer cassette. The increase will correspondingly increase the equipment manufacturing cost, and the subsequent maintenance cost will also increase. [0003] On the other hand, in the existing automatic loading and unloading system of wafer double-sided polishing equipment, both the loading robot and the unloading robot can only complete the loading and unloading process by single-chip transfer, so the loading and unloading time of the wafer is relatively long , seriously affecting the product...

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Problems solved by technology

[0002] At present, in the automatic loading and unloading system of wafer double-sided polishing equipment, the unloading buffer area is fixed, and a separate mechanical arm needs to be added to transfer the polished wafers in the unloading buffer area to the wafer cassette. The increase will correspondingly increase the equipment manufacturing cost, and the later maintenance cost will also increase

[0003] On the other hand, in the existing automatic loading and unloading system of wafer double-sided polishing equipment, both the loading robot and the unloading robot can only complete the loading and unloading process by single-chip transfer, so the loading and unloading time of the wafer is relatively long , which seriously affects the production efficiency of the wafer

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