Packaging circuit structure and manufacturing method thereof

Abstract

A packaging circuit structure comprises a shielding layer, an electronic element, a plurality of conductive columns, a first insulating layer, a first circuit board, an antenna structure and a second circuit board. The shielding layer is provided with a groove. The electronic component is fixed in the groove. The plurality of conductive columns surround the groove and are arranged on the shielding layer. The first insulating layer wraps the shielding layer, the electronic element and the plurality of conductive columns. The first circuit board is stacked on one side of the first insulating layer. The first circuit board comprises a grounding wire, and the grounding wire is electrically connected with the plurality of conductive columns. The antenna structure is stacked on the side, away from the first insulating layer, of the first circuit board and is electrically connected with the electronic component through the first circuit board. The second circuit board is stacked on the side, away from the first circuit board, of the first insulating layer. The packaging circuit structure is beneficial to avoiding electromagnetic interference and improving the heat dissipation effect. The invention further provides a manufacturing method of the packaging circuit structure.

Description

technical field [0001] The invention relates to a packaging circuit structure and a manufacturing method thereof, in particular to a packaging circuit structure with an antenna structure and a manufacturing method thereof. Background technique [0002] In recent years, electronic products are widely used in daily work and life, and light, thin and small electronic products are becoming more and more popular. As the main component of electronic products, circuit structure occupies a large space of electronic products. Therefore, the volume of circuit structure affects the volume of electronic products to a large extent. Short and small trends. [0003] The existing antenna packaging technology (such as AoC, AiP) integrates antenna modules of different frequency bands and various RF chips / active components into the package structure, but how to avoid electromagnetic interference between RF ICs / active components has become an urgent problem to be solved important topic. In a...

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Problems solved by technology

As the main component of electronic products, the circuit structure occupies a large space of electronic products. Therefore, the volume of the circuit structure affects the volume of electronic products to a large extent. short and small trend

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