Loading module and portable biaxial in-situ tensile testing machine

Abstract

The invention discloses a loading module of a biaxial in-situ tensile testing machine. The loading module comprises an upper clamp, a lower clamp, a left clamp, a right clamp, a left sleeve box, a right sleeve box, a transmission mechanism and a single driving device, the upper and lower clamps are used for clamping the upper and lower ends of a to-be-tested sample; the left and right clamps are used for clamping left and right ends of the sample; the left and right clamps are respectively in sliding fit with the upper clamp and the lower clamp; the left clamp is in sliding connection with the left sleeve box, and the right clamp is in sliding connection with the right sleeve box; the single driving device is connected to the left sleeve box or the right sleeve box and connected with the transmission mechanism, and the transmission mechanism is connected with the upper clamp and the lower clamp and used for driving the upper clamp and the lower clamp to synchronously move in the first direction under driving of the single driving device so as to drive the left clamp and the right clamp to synchronously move in the second direction. The loading module has self-balancing calibration and self-centering functions, is small in size and portable, has very high practicability, and can be used in various test scenes.

Description

technical field [0001] The invention relates to the testing fields of mechanical design, engineering materials and flexible electronic materials, in particular to a loading module and a portable biaxial in-situ tensile testing machine. Background technique [0002] Electronic chip packaging and wearable electronics are booming and in the ascendant. Microelectronic chip packaging and third-generation semiconductor chip packaging involve a variety of packaging materials and microstructures, including various polymer material films, solder solder, antenna substrates, printed circuit boards, filled polymer materials, semiconductor chip materials, etc. The material structures of flexible electronic integration include flexible substrates, silicone-based films, textile material structures, etc. Advanced sensors involve micro-material structures and nano-material structures such as graphene, nanowires, carbon nanotubes, etc. The minimum feature size of the material structure of t...

AI Technical Summary

Problems solved by technology

[0004] However, for biaxial stretching, its structure is more complicated, it is difficult to ensure the self-alignment of the test sample, and it is also difficult to ensure that the two stretching directions are synchronized and coplanar

Images