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Combined galvanometer three-dimensional laser etching equipment and method thereof

A three-dimensional laser and etching equipment technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of poor five-axis motion accuracy, difficulty in precision and density meeting MicroLED requirements, and high cost of construction

Pending Publication Date: 2022-04-08
SUZHOU DELPHI LASER
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional conductive silver paste pad printing or circuit screen printing can hardly meet the requirements of Micro LED high-resolution circuit in terms of precision and density
The common three-dimensional etching equipment on the market is mostly implemented by a five-axis platform combined with a Z-axis galvanometer. The cost is high, and the five-axis motion accuracy is poor. To meet the high-precision (machining accuracy of plus or minus 1 micron) etching requirements , it is difficult to achieve the effect

Method used

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  • Combined galvanometer three-dimensional laser etching equipment and method thereof
  • Combined galvanometer three-dimensional laser etching equipment and method thereof
  • Combined galvanometer three-dimensional laser etching equipment and method thereof

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings are not intended to limit the scope of the invention as claimed, but are merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present invention.

[0036] It should be not...

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Abstract

The invention relates to a combined galvanometer three-dimensional laser etching device and method. A laser is used for providing a laser beam; the light splitting module is arranged on an output light path of the laser and divides the laser into two paths of processing light beams; the upper galvanometer processing system is arranged on the vertical light splitting light path of the light splitting module and is used for adjusting the focus of the processing light beam to process the front surface or the back surface of the product; the side galvanometer machining system is arranged on the horizontal light splitting light path of the light splitting module and used for adjusting the focus of the machining light beam to machine the side face of the product; the vacuum adsorption platform jig is used for positioning, adsorbing and fixing the product; the X-Y-theta axis movement module is used for driving the vacuum adsorption platform jig and the product on the vacuum adsorption platform jig to enter a machining position; the image system I is used for pre-aligning a product; and the second image system is used for accurately aligning the product. Light beams enter the upper galvanometer machining system and the side galvanometer machining system after being split by the light splitting module, and polyhedron micromachining of a high-precision three-dimensional space is achieved in cooperation with the X-Y-theta axis movement module.

Description

technical field [0001] The invention relates to a combined galvanometer three-dimensional laser etching device and a method thereof. Background technique [0002] The electronic information industry is a key basic industry for high-quality economic and social development and digital transformation. In the new display field, Micro LED display has the characteristics of self-illumination, high efficiency, low power consumption, and high stability, and is the next generation mainstream display technology. An important option that has the potential to replace existing technologies in many fields. Micro LED arrays can achieve ultra-high density pixels and have self-luminous characteristics. Compared with OLED and LCD, they have higher luminous efficiency, longer life and higher brightness. Display field will be widely used. [0003] Traditional conductive silver paste pad printing or circuit screen printing is difficult to meet the high-resolution circuit requirements of Micro ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/142B23K26/082B23K26/08B23K26/03B23K26/70
Inventor 赵裕兴白计月袁浩
Owner SUZHOU DELPHI LASER
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