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Molding device

A molding device and profile technology, which is applied in the field of molding devices, can solve the problems of hindering the heat conduction of fluid heat to heat exchange coils, reducing the heat exchange of fluid to heat exchange coils, etc., so as to accelerate the heat exchange amount and speed of heat exchange, The effect of sufficient heat conduction

Pending Publication Date: 2022-04-08
江苏金荣森制冷科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The fluid flowing in the tube, especially some viscous liquids, will form a layer of mucous film on the inner tube wall, which will hinder the heat conduction of the fluid heat to the heat exchange coil, thus greatly reducing the heat exchange of the fluid to the heat exchange coil

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1, Figure 2-Figure 5 There are four main fins 801.2 of the fin group on the heat-conducting profile 801 of the special-shaped fin, and the main fins 801.2 are set throughout the length of the mandrel 801.1, and there is no dislocation of the first fin group and the second fin group, the special-shaped structure is a hole;

Embodiment 2

[0050] Embodiment 2, Figure 6-Figure 8 There are four main fins 801.2 of the fin group on the heat-conducting profile 801 of the special-shaped fins, and a 45-degree misalignment angle is formed between the first fin group and the second fin group. The special-shaped structure is a hole, and each Three holes are provided on the main fins 801.2 of each fin group.

Embodiment 3

[0051] Embodiment 3, Figure 16 The special-shaped structure on the fin group in the middle is a wave pattern.

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Abstract

The forming device is characterized by comprising a rolling wheel set, the rolling wheel set comprises a rolling male die set and a rolling female die set which are arranged up and down, and protrusions matched with special-shaped structures in size are arranged on rolling male dies at intervals in the circumferential direction; and recesses matched with the special-shaped structures in size are formed in the rolling concave die in the circumferential direction at intervals. The special-shaped structures are arranged on the main fins of the heat conduction profile produced by the forming device, the special-shaped structures not only increase the heat exchange area of fluid in a pipe, but also can continuously break a liquid mucous membrane which prevents heat from being conducted to the inner pipe wall, and the heat exchange effect of the heat conduction profile is improved.

Description

technical field [0001] The invention relates to a forming device. Background technique [0002] Heat exchange coils are widely used in heat exchange of various fluids. The fluid flowing in the tube, especially some viscous liquids, will form a layer of mucous film on the inner tube wall, which will hinder the heat conduction of the fluid heat to the heat exchange coil, thus greatly reducing the heat exchange of the fluid to the heat exchange coil . [0003] In order to improve the heat exchange effect, it is necessary to improve the structural performance of the heat-conducting profile in the heat-exchanging coil, so it is necessary to develop a corresponding forming device for the production of the heat-conducting profile. Contents of the invention [0004] The object of the present invention is to overcome the above disadvantages and provide a molding device. [0005] The purpose of the present invention is achieved like this: [0006] The forming device includes a r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/26
Inventor 黄晓军
Owner 江苏金荣森制冷科技有限公司
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