Check patentability & draft patents in minutes with Patsnap Eureka AI!

SPI bus verification method and system based on UVM

A technology of SPI bus and verification method, which is applied in special data processing applications, instruments, electrical digital data processing, etc. It can solve the problem of not being able to quickly build a verification platform, not realizing the verification of the interconnection between SPI and a higher-performance bus, and not being able to realize SPI at the same time Issues such as master-slave mode verification of running, to achieve high reusability, save verification time, and strong scalability

Pending Publication Date: 2022-04-08
SUN YAT SEN UNIV +2
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impossible to quickly build a verification platform
[0008] 2. There is no verification of the interconnection between spi and higher performance buses (such as ahb)
[0009] 3. It is impossible to realize the verification of running in SPI master and slave modes at the same time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SPI bus verification method and system based on UVM

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The idea, specific structure and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0034] The present invention proposes a UVM-based SPI bus verification method. The method only builds an ahb_agent-based ahb verification platform based on UVM with high reusability and strong expandability. The modules are respectively set to the master and slave running mode to realize the verification. And it can be accessed through the more powerful ahb bus. Different modes of the spi module can be verified in the same testcase at the same time, which greatly reduces the verification time.

[0035] Such as figure 1 As shown, the ports ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an SPI bus verification method and system based on a UVM. Ports of two spi modules are correspondingly connected to serve as DUTs, and the ports are SPI0 and SPI1. According to the technical scheme, the method comprises the following steps of: firstly, respectively setting a UVM (Universal Verification Model)-based ahb verification platform based on a UVM (Universal Verification Model) and a UVM (Universal Verification Model), respectively connecting the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM-based ahb verification platform with the UVM And access can be realized through an ahb bus with higher performance. Different modes of the spi module can be verified at the same time in the same testcase, and the verification time is greatly shortened.

Description

technical field [0001] The invention belongs to the technical fields of SPI bus verification and chip verification, and in particular relates to a UVM-based SPI bus verification method and system. Background technique [0002] As the complexity and scale of chips continue to increase, it is more likely to cause errors in the complex design process of the chip, which brings great challenges to the verification work of the chip. The higher the value, the more attention chip designers pay to the verification work of the chip. In the entire chip design cycle, the verification work has exceeded the design time by 60%-70%, which has become a general consensus in the industry. Due to the urgent need of verification work, a variety of chip verification methods have emerged. In 2006, Synopsys launched the VMM verification methodology, which integrated the register solution RAL (Register Abstraction Layer); in 2008, Cadence and Mentor introduced the OVM verification methodology, whic...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/398G06F13/42
Inventor 胡建国肖辉敏夏邦杨学彬吴劲王德明丁颜玉
Owner SUN YAT SEN UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More