Wafer inspection method, wafer inspection device, wafer inspection equipment and storage medium
An inspection method and technology of inspection equipment, which are applied in the fields of semiconductor/solid-state device parts, semiconductor/solid-state device testing/measurement, semiconductor devices, etc., can solve the problems of heavy workload of workers and large number of wafer performance parameters, etc. achieve the effect of reducing workload
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Embodiment 1
[0071] figure 1 Shows a flow chart of a wafer inspection method provided in Embodiment 1 of the present application, as figure 1 As shown, the wafer inspection method is applied to a wafer acceptance test (Wafer Acceptance Test, WAT) system, and the wafer inspection method can be realized through the following steps S101 to S104:
[0072] Step S101: Periodically obtain several wafer performance parameters output by the wafer inspection equipment, wherein the several wafer performance parameters include: in the target batch of wafers (wafer), the wafer inspection equipment in each At least one wafer performance parameter detected at each detection position on the wafer.
[0073] Specifically, the target batch of wafers includes all wafers produced in the same batch (ie: Lot), so the target batch of wafers includes at least one wafer, and for each wafer, there are At least one detection position. At each detection position, the wafer detection equipment can detect at least one...
Embodiment 2
[0136] image 3 A schematic structural diagram of a wafer inspection device provided in Embodiment 2 of the present application is shown, as shown in image 3 As shown, the wafer inspection device is applied to the wafer acceptance test system, and the wafer inspection device includes:
[0137] The acquisition module 301 is configured to periodically acquire a number of wafer performance parameters output by the wafer inspection equipment, wherein the number of wafer performance parameters include: in the target batch of wafers, the wafer inspection equipment in each At least one wafer performance parameter detected at each detection position on the wafer;
[0138] The first judging module 302 is used to obtain a judging result for each of the wafer performance parameters by judging whether the parameter value of the wafer performance parameter meets the parameter requirements preset for the wafer performance parameter; wherein, the parameter The requirement is determined fr...
Embodiment 3
[0164] The embodiment of the present application also provides a computer device 400, Figure 4 It shows a schematic structural diagram of a computer device provided by Embodiment 3 of the present application, as shown in Figure 4 As shown, the device includes a memory 401, a processor 402, and a computer program stored on the memory 401 and operable on the processor 402, wherein the memory 401 and the processor 402 are connected through a bus for communication, and the above processing The above-mentioned wafer inspection method is realized when the computer program is executed by the controller 402 .
[0165] Specifically, the above-mentioned memory 401 and processor 402 can be general-purpose memory and processor, which are not specifically limited here. When the processor 402 runs the computer program stored in the memory 401, it can execute the above-mentioned wafer inspection method, which solves the problem of existing The problem of large manual workload in technolog...
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