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Hydrolysis ceramic shell for transient circuit packaging

A technology of transient circuits and ceramic shells, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of low hardness, easy deformation, poor high temperature resistance, etc., and achieve structural strength, easy assembly and interconnection, The effect of guaranteeing transient characteristics

Pending Publication Date: 2022-04-12
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For water-triggered transient circuits, polyvinyl alcohol, polyanhydride and other high-molecular organic materials are mostly used as the structural material of the packaging shell, which has the disadvantages of poor high temperature resistance, low hardness, small modulus, and easy deformation.

Method used

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  • Hydrolysis ceramic shell for transient circuit packaging
  • Hydrolysis ceramic shell for transient circuit packaging
  • Hydrolysis ceramic shell for transient circuit packaging

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Embodiment Construction

[0024] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0025] A hydrolyzed ceramic housing for transient circuit encapsulation such as Figure 1-7 As shown, the hydrolytic ceramic shell includes: pin parts 1, metal pins 2, shell substrate 3, cap ring 5 and cover plate 6; grooves 4 are arranged on both sides of the front side of the shell substrate...

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Abstract

The invention belongs to the technical field of microelectronic packaging, and particularly relates to a hydrolysis ceramic shell for transient circuit packaging, which comprises a pin component, a metal pin, a shell substrate, a cap sealing ring and a cover plate, grooves are formed in two sides of the front surface of the shell substrate; one end of the metal pin is arranged in the groove of the shell substrate, and the other end of the metal pin is connected with the pin component; the cap sealing ring is arranged above the front surface of the shell substrate, so that the cap sealing ring and the shell substrate form a cavity, and the cavity is used for arranging a transient circuit chip; the cover plate is arranged above the cap sealing ring and is used for carrying out airtight packaging on a cavity formed by the cap sealing ring and the shell substrate; the hydrolyzable ceramic shell for the transient circuit is designed, high temperature in the packaging technology process can be resisted, the structure is convenient for assembling and interconnection of chips, and the structural strength meets the packaging technology process and subsequent use requirements.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging, and in particular relates to a hydrolyzed ceramic shell used for transient circuit packaging. Background technique [0002] Transient electronic technology involves materials science, electronics, physics, chemistry and other disciplines. It is a brand-new scientific and technological field in the field of microelectronics, which is highly innovative and subversive. The "transient circuit" can work stably under normal conditions. When the device is out of control, its physical form and function can immediately disappear partly or completely under the trigger of external stimuli, and achieve little or no traceable residue. The corresponding conventional circuit can be understood as a "constant circuit", that is, the pursuit of stable performance and physical firmness and reliability. [0003] Due to the characteristics of stable and reliable transient circuits and disappearing t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/06H01L23/08H01L23/04H01L23/10
Inventor 廖希异陈容李艳琼郑旭张正元张培健陈仙王妍蒋飞宇邱盛
Owner NO 24 RES INST OF CETC
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