Ultraviolet device packaging structure

Abstract

The invention provides an ultraviolet device packaging structure, and relates to the technical field of semiconductor packaging structures, the ultraviolet device packaging structure comprises a substrate, a light emitting cup, an ultraviolet LED light emitting diode chip, a protection chip and a detection chip, the front surface of the substrate is provided with a front surface circuit layer, and the back surface of the substrate is provided with a bonding pad; the inner wall of the light-emitting cup is a condensation type reflective surface, two ends of the light-emitting cup are open, one end of the light-emitting cup is a light-emitting port, and the other end of the light-emitting cup is fixedly arranged on the front surface of the substrate; the ultraviolet LED chip, the protection chip and the detection chip are all arranged in the functional area of the front circuit layer; the detection chip and the protection chip are both located on the side, away from the light outlet, of the ultraviolet LED chip, the detection chip is used for receiving photons of ultraviolet light emitted by the ultraviolet LED chip and outputting the photons to an amplification circuit outside the device for analysis and judgment of the radiation quantity, and a lens is fixedly arranged at the light outlet; the ultraviolet device packaging structure provided by the invention can enhance and ensure the disinfection effect.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging structures, in particular to an ultraviolet device packaging structure. Background technique [0002] Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection and pollution-free, and small size. The light radiates energy, and due to the material and structure of the deep ultraviolet light emitting diode chip, the antistatic ability of the deep ultraviolet light emitting diode chip is weak, and special antistatic diode LED chips are required to be connected in parallel for protection. The conventional packaging structure is to protect the diode LED chip and place it in the ultraviolet LED In the parallel circuit of light-emitting diode chips, the distance to the deep-ultraviolet light-emitting diode chip is relatively close, which affects the light emission of the deep-ultravi...

AI Technical Summary

Problems solved by technology

[0002] Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection and pollution-free, and small size. The light radiates energy, and due to the material and structure of the deep ultraviolet light emitting diode chip, the antistatic ability of the deep ultraviolet light emitting diode chip is weak, and special antistatic diode LED chips are required to be connected in parallel for protection. The conventional packaging structure is to protect the diode LED chip and place it in the ultraviolet LED In the parallel circuit of light-emitting diode chips, the distance to the deep-ultraviolet light-emitting diode chip is relatively close, which affects the light emission of the deep-ultraviolet light-emitting diode chip on the corresponding side of the protective diode LED chip, causing shading and absorption;

[0003] In addition, after the deep ultraviolet LED light-emitting diode LED chip is packaged, it is widely used in water sterilization, air sterilization, surface sterilization and other fields. In order to ensure the sterilization effect, it is necessary to continuously output the dose of deep ultraviolet radiation to achieve disinfection. However, due to the increase in the use time of the deep ultraviolet light-emitting diode LED chip or the environment in which it is located, the light radiation energy emitted by the light-emitting diode LED chip will attenuate, and the radiation energy will become lower, so that the deep ultraviolet light required for sterilization and disinfection cannot be met. radiation dose, thereby reducing the quality of disinfection, therefore, there is an urgent need for a new UV device packaging structure to solve the above problems

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