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Preparation method of PCB (Printed Circuit Board) and PCB

A core board and conductive layer technology, which is applied in the preparation of PCB and the field of PCB, can solve the problems of multiple drilling and multiple pressing, and achieve the effects of improving production efficiency, high hole position accuracy and simple preparation method.

Pending Publication Date: 2022-04-12
DONGGUAN SHENGYI ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a PCB preparation method and PCB, aiming to solve the problem of multiple pressing and multiple drilling

Method used

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  • Preparation method of PCB (Printed Circuit Board) and PCB
  • Preparation method of PCB (Printed Circuit Board) and PCB
  • Preparation method of PCB (Printed Circuit Board) and PCB

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Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses a preparation method of a PCB and the PCB, and the method comprises the steps: attaching a first water-absorbent resin to a pre-trepanning region corresponding to a first core board; the first core plate and the second core plate are laminated after being stacked, a multi-layer plate is formed, and the first water-absorbent resin is located between the first core plate and the second core plate; drilling a hole in the pre-trepanning area corresponding to the multi-layer board to form a through hole; performing chemical copper deposition on the multilayer board to enable the first water-absorbent resin to absorb water, and depositing a conductive layer on the inner wall of the through hole; the multi-layer board is dried, so that the first water-absorbent resin expands in volume and protrudes out of the inner wall face of the through hole; and disconnecting the conductive layer positioned on the first core board from the conductive layer positioned on the second core board. According to the technical scheme of the invention, the problems of multiple times of plate pressing and multiple times of drilling of the PCB are solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for preparing a PCB and the PCB. Background technique [0002] The double-sided crimping circuit board has the effect of increasing the wiring density of the crimping device, significantly increasing the number of devices to achieve the effect of increasing the signal transmission capacity. Therefore, the double-sided crimping circuit board has become a typical circuit board with increased efficiency. In the related art, the main manufacturing processes of double-sided crimping circuit boards include double-sided crimping with large and small holes and N+N double-sided blind crimping. Among them, the double-sided crimping method with large and small holes requires multiple drillings, and the N+N double-sided blind pressing method requires multiple pressing plates, and the production process is complicated. Contents of the invention [0003] The main pur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/38H05K3/46
Inventor 焦其正纪成光王洪府王小平
Owner DONGGUAN SHENGYI ELECTRONICS
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