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Cooling device

A cooling device and refrigerant technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of poor cooling effect and inability to cool down devices, and achieve the effect of lowering temperature, good cooling effect, and improving heat exchange efficiency

Pending Publication Date: 2022-04-12
SUGON DATAENERGYBEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cooling effect of many current cooling devices is not good, and it is impossible to effectively cool down the device

Method used

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  • Cooling device
  • Cooling device
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Embodiment Construction

[0034] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0035] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to a cooling device which is used for cooling a to-be-cooled device through a refrigerant and comprises a first flow guide part and a second flow guide part. The second flow guide part and the first flow guide part are arranged in a spaced mode, a flowing gap allowing the refrigerant to flow is formed between the second flow guide part and the first flow guide part, the second flow guide part is used for being connected with the device to be cooled, and the second flow guide part comprises a heat exchange area used for making contact with the refrigerant. And the connecting area is used for being connected with the to-be-cooled device, and the area of the heat exchange area is larger than that of the connecting area. According to the cooling device, the to-be-cooled device can be cooled, the cooling effect is good, the temperature of the to-be-cooled device can be effectively reduced, and the probability that the temperature of the to-be-cooled device is too high and breaks down is reduced.

Description

technical field [0001] The invention relates to the technical field of heat exchange and cooling, in particular to a cooling device. Background technique [0002] In computer rooms, data centers and other places, many electronic devices will generate a lot of heat during operation, resulting in high temperature after a long time of work, and excessive temperature may affect the normal operation of electronic devices. Therefore, usually for These electronics are equipped with a cooling unit. In related technologies, more refrigerants are used for cooling, so that the refrigerant flows through the surface of the electronic device. During the flow of the refrigerant, it will exchange heat with the electronic device and take away the heat from the surface of the electronic device to achieve cooling of the electronic device. cool down. However, many current cooling devices have poor cooling effect, and cannot effectively cool down the device. Contents of the invention [000...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 张鹏郭双江伊波力关毅
Owner SUGON DATAENERGYBEIJING CO LTD
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