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Mounting structure and method of electroplating wastewater recording sensor in electroplating centralized control area

A technology for electroplating wastewater and installation structure, which is applied in the direction of using electrical devices, instruments, measuring devices, etc., can solve the problems of no measurement and detection, no emission control, troublesome management and control of electroplating enterprises, etc., to achieve the effect of low cost and reasonable structure

Pending Publication Date: 2022-04-15
CHINA NEW ERA INT ENG CORP
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Problems solved by technology

[0007] The above-mentioned heavy metal ions such as chromium, zinc, copper, lead, and nickel are directly discharged into nature by gravity, that is, there is no measurement and detection at the export, or no measurement and detection equipment is installed, so the discharge amount or The production process involved is not controlled in the last link, which brings troubles for the supervision and management department to control the electroplating enterprises

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  • Mounting structure and method of electroplating wastewater recording sensor in electroplating centralized control area
  • Mounting structure and method of electroplating wastewater recording sensor in electroplating centralized control area
  • Mounting structure and method of electroplating wastewater recording sensor in electroplating centralized control area

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Embodiment Construction

[0027] Such as figure 1 , figure 2 , Figure 3-1 , Figure 3-2 , Figure 4As shown, a production supervision method based on the pipeline flow in the electroplating centralized control area, the upper and lower layer pipe racks 2, the lower layer pipe racks 3, and the upper and lower layer pipe rack support columns 4 are connected and fixed to form the support of the upper and lower discharge pipelines 1 Body; the support columns 4 of the upper and lower layer pipe racks are distributed at intervals in the horizontal direction, so that the discharge pipelines 1 of different wastewater discharge water are fixed in the interval, and each discharge pipeline 1 of different wastewater discharge water is fixed and clamped by the discharge pipeline The frame 5 is clamped and fixed, and it is characterized in that: a fluid flow sensing unit 6 is socketed and fixed on the support column 4 of the upper and lower interlayer pipe racks, and the fluid flow sensing unit 6 includes an up...

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Abstract

The invention relates to a wastewater treatment technology, in particular to wastewater treatment management in the electroplating industry, in particular to a mounting structure and a mounting method for an electroplating wastewater recording sensor in an electroplating centralized control area, which are characterized in that digital flow measuring units (9) are respectively mounted in electroplating wastewater discharge pipelines; and a digital flow measurement unit (9-1), a digital flow measurement unit (9-2), a digital flow measurement unit (9-3), a digital flow measurement unit (9-4) and a digital flow measurement unit (9-5) which are separated by space boundaries (12) are respectively arranged on a chromium treatment water discharge pipeline (1-1) of the discharge pipeline. The invention provides an electroplating wastewater recording sensor mounting structure and method in an electroplating centralized control area, so that the production state and the discharge amount of chromium, zinc, copper, lead and nickel treatment water at different time can be known at any time.

Description

[0001] This case is a divisional application with the title of the invention "A production supervision method based on the flow of pipelines in the electroplating centralized control area" and the filing date "2021 / 3 / 16" and "2021102828280". technical field [0002] The invention relates to waste water treatment technology, in particular to waste water treatment management in the electroplating industry, specifically a structure and method for installing an electroplating waste water recording sensor in an electroplating centralized control area. Background technique [0003] The wastewater output of the electroplating industry is less than that of papermaking, printing and dyeing, and chemical industries. However, due to the wide distribution of electroplating factories, there are many types of harmful substances contained in electroplating wastewater. Therefore, the treatment of electroplating wastewater is very important. Electroplating wastewater mainly contains chromium,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01F1/05G01F15/18G01H9/00G01H11/06
CPCG01F1/05G01H9/00G01H11/06G01F15/18G01F15/185
Inventor 张焕东于永胜李凯军吴健费西凯
Owner CHINA NEW ERA INT ENG CORP