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Failure chip stripping method

A chip and peeling technology, applied in the field of semiconductor chip inspection, can solve the problems of chip sample failure analysis, damage to chip samples, etc., to achieve the effect of improving accuracy, improving uniformity, and improving clarity

Active Publication Date: 2022-04-15
晶芯成(北京)科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, in the process of peeling off the layer, it is easy to have the failure ana

Method used

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Embodiment Construction

[0045] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0046] The failure analysis of the chip is of great significance to the production and use of the product. The failure of the chip may occur in various stages of the product life cycle, involving product R&D and design, incoming material inspection, processing and assembly, testing and screening, client use and other links. . Through the analysis of process waste, early failure, test failure, pilot test failure and field failure samples, confirm the failure mode, a...

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PUM

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Abstract

The invention discloses a layer stripping method for a failed chip, which at least comprises the following steps of: acquiring a failed chip to be analyzed, and confirming a target area of the failed chip; preprocessing the invalid chip to expose the metal wiring of the target area; removing the metal wiring, and cleaning the invalid chip; and grinding the dielectric layer of the target area to obtain a delaminated sample, wherein the step of removing the metal wiring comprises the following steps of: pasting a mucous membrane on the metal wiring; and after the adhesive film is adhered to the metal wiring, removing the adhesive film so as to remove the metal wiring. The invention provides a layer stripping method for a failed chip, which can improve the uniformity of physical layer stripping of the chip.

Description

technical field [0001] The invention belongs to the field of inspection of semiconductor chips, in particular to a method for peeling off layers of invalid chips. Background technique [0002] When an abnormality occurs in the chip test, it is necessary to perform a corresponding failure analysis on the chip with an abnormal test. The failure analysis of the chip needs to peel off the chip layer by layer from top to bottom through physical peeling to find out the problem. At present, in the process of peeling off the layer, it is easy to have the failure analysis problem of the chip sample, and there is also the risk of damaging the chip sample. Contents of the invention [0003] The purpose of the present invention is to provide a peeling method for a failed chip, which can improve the uniformity of physical peeling of the chip, so as to improve the accuracy of failure analysis of the chip sample and protect the chip sample from damage. [0004] In order to solve the pr...

Claims

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Application Information

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IPC IPC(8): G01N23/2202
Inventor 俞佩佩王丽雅胡明辉
Owner 晶芯成(北京)科技有限公司
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