Cover plate assembly and manufacturing method thereof
A manufacturing method and cover plate technology, which is applied in the direction of electrical components, electrical solid devices, semiconductor devices, etc., can solve problems such as deformation of flexible device materials, achieve the effects of reducing perception, improving appearance, and improving creases
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[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0025] In addition, the terms first, second, third, etc. mentioned in the present invention may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish these elements from one another. For example, a first type could be termed a second type, and similarly, a second type could be termed the first type without departing from the scope of the present applicati...
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