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Surface polishing device for power electronic component manufacturing

A technology for power electronics and components, applied in the field of surface grinding devices for the manufacture of power electronic components, can solve the problems of high labor intensity, low grinding efficiency, unsatisfactory grinding effect, etc., and achieves wide applicability and high grinding efficiency. Effect

Inactive Publication Date: 2022-04-22
徐州瀚胜源电子科技有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing power electronic components are inconvenient to fix and place components of different sizes during the grinding process, and the power electronic components cannot be fully and effectively polished, and the grinding effect is not ideal. The surface treatment of surface components has low polishing efficiency, cumbersome operation, and high labor intensity, which affects the polishing effect of electronic components

Method used

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  • Surface polishing device for power electronic component manufacturing
  • Surface polishing device for power electronic component manufacturing
  • Surface polishing device for power electronic component manufacturing

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Embodiment Construction

[0019] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0020] The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals.

[0021] It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0022] In order to make the content of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0023] In conjunction with the accompanying drawings, a surface...

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Abstract

The invention discloses a surface polishing device for power electronic component manufacturing, which comprises a base, the front end of the base is provided with an extension table, the extension table and the base are respectively provided with a front end plate and a rear end plate, a processing table capable of moving back and forth is arranged between the front end plate and the rear end plate, the processing table is provided with a fixed seat, and the fixed seat is provided with a fixed seat. A fixing plate and a rear clamping plate are arranged at the front end and the rear end of the upper end face of the fixing seat respectively, a front clamping plate is arranged on the fixing seat in a sliding mode, a pushing screw rod is rotatably arranged on the fixing plate, two supporting columns are oppositely arranged on the base, a connecting plate is arranged at the upper ends of the two supporting columns, and a mounting plate is arranged at the front end of the connecting plate. A first hydraulic cylinder is arranged on the mounting plate, a lifting plate located below the mounting plate is arranged at the bottom end of a piston rod of the first hydraulic cylinder, and a grinding mechanism is arranged at the bottom of the lifting plate. Compared with the prior art, the power electronic component polishing device has the advantages that the polishing efficiency is high, and power electronic components of different sizes can be automatically polished.

Description

technical field [0001] The invention relates to the technical field of power electronic components processing, in particular to a surface grinding device for the manufacture of power electronic components. Background technique [0002] Nowadays, there are more and more electronic products. In order to protect the confidentiality of their products, manufacturers will polish some electronic components inside the products. [0003] The existing power electronic components are inconvenient to fix and place components of different sizes during the grinding process, and the power electronic components cannot be fully and effectively polished, and the grinding effect is not ideal. The surface treatment of surface components has low polishing efficiency, cumbersome operation, and high labor intensity, which affects the polishing effect of electronic components. Contents of the invention [0004] The technical problem to be solved by the present invention is to overcome the above ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B19/00B24B41/06B24B41/02B24B47/06B24B47/12B24B27/02
CPCB24B19/00B24B41/06B24B41/02B24B47/06B24B47/12B24B27/02
Inventor 臧月
Owner 徐州瀚胜源电子科技有限公司
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