Heat dissipation device

Abstract

The invention provides a heat dissipation device. The heat dissipation device comprises a heat dissipation body and a fan. The heat dissipation body comprises a first heat dissipation fin set and a second heat dissipation fin set stacked on the first heat dissipation fin set. The first heat dissipation fin group comprises a plurality of first heat dissipation fins, and the second heat dissipation fin group comprises a plurality of second heat dissipation fins. The fan is arranged on the second radiating fin group in an overlapping manner, the fan is used for rotating around an axis, and the plurality of first radiating fins and the plurality of second radiating fins are arranged around the axis.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device using a double-layer heat dissipation fin group. Background technique [0002] As the computing performance of electronic components (such as chips, processors or controllers) improves, the heat generated by the electronic components (such as chips, processors or controllers) during operation is also increasing. Once the heat cannot dissipate to the outside quickly, it will cause the computing performance of the electronic components (such as chips, processors or controllers) to decline or become disabled due to overheating. Therefore, relevant manufacturers are all actively investing in the development and improvement of various forms of heat dissipation devices to improve heat dissipation efficiency. [0003] A common heat dissipation device includes a fan and a heat dissipation fin set, wherein the fan is stacked on the heat dissipation fin set, and the h...

AI Technical Summary

Problems solved by technology

Generally speaking, the heat dissipation fin group adopts a single-layer design, that is to say, multiple heat dissipation fins in the heat dissipation fin group are arranged at the same height, so there is not enough space for gas flow, and the heat dissipation area is also insufficient, resulting in poor cooling efficiency

In addition, the airflow caused by the operation of the fan will flow through the plurality of heat dissipation fins for heat exchange. The number and arrangement of the plurality of heat dissipation fins will affect the heat dissipation area and flow resistance, and even cause the heat dissipation of the heat dissipation fins when the fan is running. making too much noise

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