Convenient compatible wafer centering device
An alignment device, compatible technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer clipping, alignment errors, and inability to judge whether there is a wafer on the alignment device platform. To achieve the effect of reliable use and simple structure
Pending Publication Date: 2022-04-26
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
The above two technical means realize the wafer alignment through the movement of the mechanical structure, and in order to ensure the accuracy, the wafer needs to be clamped, which is very easy to crush the wafer after the operation, and if the gap is kept, it will cause alignment errors
Moreover, during the wafer alignment process, the two technical methods cannot judge whether there is a wafer on the centering device platform, or whether it is tilted with the wafer, and rely on human observation
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[0027] Attached below Figure 1-6 The present invention is described in further detail.
[0028] A convenient and compatible wafer centering device, such as figure 1 and figure 2 As shown, it includes a base 1 on which two symmetrically arranged centering blocks 2 are installed, and two centering blocks 2 are respectively provided with two layers of centering brackets 3 for centering the wafer. The setting positions of the centering brackets 3 of each layer on the centering block 2 of the centering block 2 on the other side are symmetrical to each other, and the alignment brackets 3 of each layer The central axes are all collinear with the axial centerlines of the wafers after they are correctly aligned. The outer layer centering bracket 3 is used for centering the six-inch wafer 001, and the inner layer centering bracket 3 is used for centering the four-inch wafer 002.
[0029] Such as figure 2 As shown, the centering brackets 3 of each layer are provided with an outer...
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The invention belongs to the technical field of semiconductor wafer processing, and particularly relates to a convenient compatible wafer centering device which comprises a base, two centering blocks are mounted on the base, and a plurality of layers of centering brackets for centering wafers are arranged on the two centering blocks respectively. And each layer of centering bracket is provided with an outer slope surface and an inner bearing surface which are sequentially arranged from outside to inside, and is also provided with an in-place detection sensor assembly and an inclination detection sensor assembly. According to the invention, through the arrangement of the centering bracket provided with the outer slope surface and the inner bearing surface, automatic centering of the wafer is realized, damage to the wafer caused by using a mechanical structure can be avoided, the structure is simple, and the use is reliable; through the arrangement of the laser sensors on the centering brackets, whether wafers exist on the centering device or not can be detected, whether the centering process of the wafers is accurately completed or not can be fed back, workers do not need to observe the conditions of the wafers all the time, and the wafer centering device is more suitable for developing full-automatic wafer processing equipment at a high speed.
Description
technical field [0001] The invention belongs to the technical field of semiconductor wafer processing, in particular to a convenient and compatible wafer centering device. Background technique [0002] At present, most of the wafer centering mechanisms use the clamping action of the cylinder jaws or the rotating mechanism to drive the screw to realize the center position of the wafer. The above two technical means realize the wafer alignment through the movement of the mechanical structure, and in order to ensure the accuracy, the wafer needs to be clamped, which is very easy to crush the wafer after the operation, and if the gap is left, it will cause alignment errors. Moreover, during the wafer alignment process, the two technical means cannot judge whether there is a wafer on the centering device platform, and whether it is tilted with the wafer, and rely on human observation. Contents of the invention [0003] In view of the above problems, the object of the present i...
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Login to View More IPC IPC(8): H01L21/68
CPCH01L21/681H01L21/68
Inventor 戴红峰王一关贺聲王本义刘迟于宏嘉
Owner SHENYANG KINGSEMI CO LTD