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5G system comprising polymer composition

A composition and polymer technology, which is applied in transmission systems, radio transmission systems, antenna arrays that are powered independently, etc., can solve the problems of high-frequency performance impact, power consumption and heat generation increase, etc.

Pending Publication Date: 2022-04-26
TICONA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Unfortunately, the high frequency transmit and receive encountered in 5G applications generally results in increased power consumption and heat generation
Therefore, materials often used in conventional electronic components can negatively affect high frequency performance

Method used

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  • 5G system comprising polymer composition
  • 5G system comprising polymer composition
  • 5G system comprising polymer composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0122] Sample 1 to Sample 2 are used in 5G system. LCP 1 was formed from 60% HBA, 4% HNA, 18% TA and 18% BP. LCP2 is formed from 48% HNA, 2% HBA, 25% BP and 25% TA. Compounding was performed using an 18 mm single screw extruder. Samples were injection molded into panels (60mm x 60mm). The formulation is described below.

[0123] sample 1 sample 2 LCP 1 57.4 copper chromite 6.6 talc 16 glass fiber 20 LCP 2 67 Mica 22 glass powder 10 pigment 1

[0124] The thermal and mechanical properties of samples 1 to 2 were tested. The result is shown below.

[0125]

[0126]

Embodiment 2

[0128] Samples 3 to 5 were extruded into films for 5G systems. Sample 3 contained 100 wt.% LCP 3 formed from 73% HBA and 27% HNA. Sample 4 contained 100 wt.% LCP 4 formed from 79.3% HBA, 20% HNA and 0.7% TA. Sample 5 contained 75 wt.% LCP 3 and 25 wt.% PTFE. The thermal and mechanical properties of samples 3 to 5 were tested. The result is shown below.

[0129] sample 3 Sample 4 Sample 5 Dk@10GHz 3.42 3.36 3.12 Df@10GHz 0.0017 0.0017 0.0016 Melting point (°C) 280 325 280 Tensile strength (MPa) 148 150 156 Tensile modulus (MPa) 7800 8200 7,000 Tensile elongation (%) 5.7 3.7 6.2 Bending strength (MPa) 158 145 125 Flexural modulus (MPa) 9,100 7,300 7,100 DTUL under 1.8MPa 193 175 165

Embodiment 3

[0131] Samples 6 to 8 were extruded into films for use in printed circuit boards. Sample 6 contained 80 wt.% LCP 5 and 20 wt.% PTFE, sample 7 contained 75 wt.% LCP 5 and 25 wt.% PTFE 1, and sample 8 contained 75 wt.% LCP 4 and 25 wt.% PTFE. LCP 5 was formed from 43% HBA, 9% TA, 29% Hq and 20% NDA. In addition, the D50 particle size of PTFE 1 is 4 μm, and the D90 particle size is 15 μm.

[0132] The thermal and mechanical properties of samples 6 to 8 were tested. The result is shown below.

[0133] Sample 6 Sample 7 Sample 8 Dk@10GHz 3.10 3.06 3.13 Df@10GHz 0.0013 0.0013 0.0017 Dk@2GHz 3.04 3.01 - Df@2GHz 0.0017 0.0017 - Melt viscosity (1000s -1 , 340°C)

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Abstract

There is provided a 5G system including at least one antenna element configured to transmit and receive a 5G radio frequency signal and at least one electronic component. The antenna element, the electronic component, or both, includes a polymer composition including a liquid crystal polymer containing repeating units derived from a naphthenic hydroxycarboxylic acid and / or a naphthenic dicarboxylic acid in an amount of about 10 mol.% or more. Further, the polymer composition exhibits a dielectric constant of about 5 or less and a dissipation factor of about 0.05 or less at a frequency of 10 GHz.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of the following applications: U.S. Provisional Patent Application Serial No. 62 / 898,188, filed September 10, 2019; U.S. Provisional Patent Application Serial No. 62 / 904,089, filed September 23, 2019; U.S. Provisional Patent Application Serial No. 62 / 925,274 dated October 24, 2019; U.S. Provisional Patent Application Serial No. 62 / 951,039 filed December 20, 2019; U.S. Provisional Patent Application Serial No. 62 / 951,039 filed December 20, 2020 Provisional Patent Application Serial No. 62 / 972,195; U.S. Provisional Patent Application Serial No. 62 / 986,072 filed March 6, 2020; U.S. Provisional Patent Application Serial No. 62 / 994,321 filed March 25, 2020; U.S. Provisional Patent Application Serial No. 63 / 008,989, dated April 13, 2020; U.S. Provisional Application Serial No. 63 / 024,560, filed May 14, 2020; and U.S. Provisional Application Serial No. 63 / 024,560, filed May 14, 2020; Provisio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K19/38H01Q1/36H04W72/04
CPCH01Q1/246H01Q21/065H01Q21/08H01Q3/44C08G63/605C08K7/14C08K2201/016C08K7/24C08K3/22C08K2003/2251C08K2003/2227C08L67/03C08L67/04C08G63/065C08K3/18C08K3/34C08K3/40H04B7/0413C08K3/36C08K7/20H01Q21/061
Inventor 张小伟赵新宇金荣申H·A·琼C·麦克格雷迪
Owner TICONA LLC