A material box alternate conveying device for ic detection

Abstract

The invention relates to an alternate conveying device for material boxes for IC detection, which belongs to the technical field related to IC detection, and includes a feeding mechanism, a feeding mechanism, a lower stop mechanism and a feeding mechanism; the number of feeding mechanisms is two, and they are all arranged in The lower end of the material mechanism, the quantity of the lower stop mechanism is four, and every two lower stop mechanisms are all arranged on the upper end of a blanking mechanism, and the feeding mechanism is located at the discharge end of the lower end of the blanking mechanism. The present invention facilitates the alternate automatic feeding operation filled with IC material boxes when performing IC detection through the feeding mechanism, unloading mechanism, lower stop mechanism and loading mechanism, and can store multiple rows of material boxes at a time. Therefore, the frequency of placing the material box is reduced, and the work intensity of the operator is reduced. At the same time, the efficiency of material feeding is significantly improved through the alternate feeding method.

Description

technical field [0001] The invention relates to the related technical field of IC detection, in particular to a device for alternately conveying material boxes for IC detection. Background technique [0002] IC is a miniature electronic component composed of a built-in chip, pins arranged on the chip and a package packaged outside the chip. When the IC is processed, the chip is generally cut first, and then the lead frame is processed. Then, the chip is pasted on the base island corresponding to the lead frame through solder paste, and the chip is packaged after completion. Then, the processed IC is tested. The test is mainly used to test whether the appearance structure of the IC is complete, whether the chip works normally when it is connected to the circuit, and whether the package is tight. Generally, for larger ICs, the processed chips are often filled in a long strip box. When testing, the ICs are poured out of the box one by one, and then their performance is measure...

AI Technical Summary

Problems solved by technology

This filling method can only carry out the discharging operation of a single material box at a time, so the detection efficiency is low. Secondly, because only a single column of material boxes can be placed on the shelf, it is necessary to place the material boxes frequently during operation. As a result, the work intensity of the operator is increased, and the phenomenon of idling of the detection equipment often occurs, which affects the detection efficiency of the IC

Images