Material box alternate conveying device for IC detection

Abstract

An alternative conveying device for material boxes for IC (integrated circuit) detection belongs to the related technical field of IC detection and comprises a feeding mechanism, a discharging mechanism, a lower blocking mechanism and a loading mechanism. The number of the discharging mechanisms is two, the discharging mechanisms are arranged at the lower end of the feeding mechanism, the number of the lower blocking mechanisms is four, every two lower blocking mechanisms are arranged at the upper end of one discharging mechanism, and the feeding mechanism is arranged at the discharging ends of the lower ends of the discharging mechanisms. When IC detection is carried out through the feeding mechanism, the discharging mechanism, the lower blocking mechanism and the feeding mechanism, alternate automatic feeding operation of material boxes filled with IC is conveniently carried out, multiple rows of material boxes can be stored at a time, therefore, the material box placing frequency is reduced, the working intensity of operators is reduced, meanwhile, through the alternate feeding mode, the working efficiency is improved, and the working efficiency is improved. And the feeding efficiency is obviously improved.

Description

technical field [0001] The invention relates to the technical field related to IC detection, in particular to a material box alternate conveying device for IC detection. Background technique [0002] IC is a microelectronic component composed of a built-in chip, pins arranged on the chip, and a package packaged outside the chip. When the IC is being processed, the chip is generally cut first, and then the lead frame is processed. Then paste the chip on the base island corresponding to the lead frame through solder paste, and package the chip after completion. Then, the processed IC is inspected. The inspection is mainly used to detect whether the appearance structure of the IC is complete, whether the chip works normally when connected to the circuit, and whether the package is tight. Generally, for larger ICs, the processed chips are often packed in a strip-shaped material box. When testing, the ICs are poured out of the material box one by one, and then the performance is...

AI Technical Summary

Problems solved by technology

This filling method can only carry out the discharging operation of a single material box at a time, so the detection efficiency is low. Secondly, because only a single column of material boxes can be placed on the shelf, it is necessary to place the material boxes frequently during operation. As a result, the work intensity of the operator is increased, and the phenomenon of idling of the detection equipment often occurs, which affects the detection efficiency of the IC

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