Wafer structure

Abstract

A wafer structure comprises: a chip substrate which is a silicon substrate and is manufactured by a semiconductor process of a wafer of at least 12 inches; the at least one ink-jet chip is directly generated on the chip substrate by a semiconductor manufacturing process and is cut into at least one ink-jet chip to be applied to ink-jet printing; wherein the ink jet chip comprises a plurality of ink droplet generators which are manufactured and generated on the chip substrate through a semiconductor manufacturing process, and the ink jet chip is configured to be a plurality of longitudinal axis array groups which extend along the longitudinal direction and keep a distance between adjacent ink droplet generators, and a plurality of horizontal axis rows configured to extend horizontally and maintain a central step pitch adjacent to the droplet generators, the central step pitch being at least 1 / 600 inch or less.

Description

【Technical field】 [0001] This case relates to a wafer structure, especially a wafer structure of an inkjet chip suitable for inkjet printing produced by semiconductor manufacturing process. 【Background technique】 [0002] In addition to laser printers, inkjet printers are another widely used type of printers currently on the market. They have the advantages of low price, easy operation, and low noise, and can print on various types of paper, such as paper and photo paper. Inkjet media. The printing quality of an inkjet printer mainly depends on factors such as the design of the ink cartridge, especially the design of the inkjet chip to release ink droplets to the inkjet medium is an important consideration in the design of the ink cartridge. [0003] In the highly competitive inkjet printing market, the price of inkjet printers has dropped rapidly as inkjet chips are pursuing higher print quality requirements for high-resolution and higher-speed printing. The manufacturing...

AI Technical Summary

Problems solved by technology

If the printable range (printing swath) of an inkjet chip on a wafer structure below 6 inches exceeds 1 inch (inch) or the page width printable range (printing swath) A4 size (8.3 inches (inch)) to Under the requirements of higher high-resolution and higher-speed printing, the number of required inkjet chips will be quite limited when compared to the wafer structure with a limited area below 6 inches. Manufacturing demanded inkjet chips on a wafer structure with a limited area below 6 inches will waste the remaining blank area, and these blank areas will occupy more than 20% of the entire wafer area, which is quite wasteful. cost can not be effectively reduced

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