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Wafer conveying system and wafer conveying method

A transmission system and wafer transfer box technology, applied in the direction of conveyor objects, electrical components, transportation and packaging, etc., can solve the problems of slow transmission speed, affecting hourly production capacity, and high equipment requirements, so as to reduce the possibility of impact and guarantee Conveys the effect of safety and improvement of turning speed

Pending Publication Date: 2022-05-06
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. There are many transmission contact points, and it is difficult to find the cause of problems;
[0005] 2. The transmission speed is slow;
[0006] 3. The rotation speed of the bearing unit to generate batches is relatively slow;
[0007] 4. High requirements for equipment;
[0008] 5. The transmission speed is slow after the equipment takes out the wafer
[0009] The above-mentioned problems existing in the conveying mode of the existing wet batch processing machine will seriously affect the hourly production capacity

Method used

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  • Wafer conveying system and wafer conveying method
  • Wafer conveying system and wafer conveying method
  • Wafer conveying system and wafer conveying method

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Embodiment Construction

[0033] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown in the drawings.

[0034] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. In the following, many specific details of the present invention, such as structures, materials, dimensions, processes and techniques of components, are described for a clearer understanding of the present invention. However, the invention may be practiced without these specific details, as will be understood by those skilled in the art.

[0035] It should be understood that when describing the structure of a component, when a layer or ...

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Abstract

The invention discloses a wafer transfer system and a wafer transfer method. According to the embodiment of the invention, the wafer conveying system comprises a wafer conveying box used for placing a wafer to be conveyed; the bearing unit is used for being connected with the wafer conveying box so as to bear the wafer conveying box; the transfer unit is used for obtaining the wafers to be conveyed from the wafer conveying box and transferring the wafers to the base station; and the base station is used for receiving the wafer to be conveyed. According to the wafer conveying system and the wafer conveying method provided by the embodiment of the invention, the productivity per hour and the processing effect of the wet-process batch processor are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer delivery system and a wafer delivery method. Background technique [0002] At present, in semiconductor manufacturing, a wafer (wafer) must go through a process flow consisting of hundreds of processes in sequence before it can be made into a final product. A batch of wafers produced by the same process flow can be called a chip group (Lot). When the current processes of different Lots are the same, different Lots can be dispatched to the same machine for processing, and a machine capable of processing multiple Lots at the same time is called a batch processing (Batch) machine. [0003] In the existing semiconductor process, the wet batch processor in the wet process can process up to 50 wafers at a time. The hourly capacity (Wafer Per Hour, WPH) of the wet batch processor is mainly related to the time of the process, but when the process time is sho...

Claims

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Application Information

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IPC IPC(8): H01L21/677
CPCH01L21/67763H01L21/67781H01L21/67766
Inventor 李君
Owner YANGTZE MEMORY TECH CO LTD
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