Circuit board and preparation method thereof
A circuit board and circuit area technology, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve problems such as line pollution, board breakage, and insufficient rigidity of the circuit board edge
Pending Publication Date: 2022-05-06
QI DING TECHNOLOGY QINHUANGDAO CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Therefore, circuit boards are prone to problems of board cracking and board breakage due to insufficient rigidity of the board edge.
In addition, the substrate layer exposed on the edge of the circuit board is prone to debris, which will cause problems such as line pollution and scratches after the debris falls, and the overall yield rate will be lost
Method used
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[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them.
[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.
[0050] In order to further explain the technical means and effects adopted by the present invention to achieve the intended purpose, the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.
[0051] figure 1 It is a ...
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The embodiment of the invention provides a circuit board and a preparation method thereof. The preparation method comprises the steps that a conductive layer is formed on a base material, a circuit area and a peripheral area surrounding the circuit area are defined on the base material, the base material is provided with a side face connected with and surrounding the peripheral area, and the conductive layer is located on the side face, the peripheral area and the circuit area; forming a protective layer on the conductive layer, wherein the protective layer is located on the side surface and the peripheral region; the conductive layer is patterned, so that the conductive layer located in the circuit area is patterned to form a circuit layer, and the conductive layer located on the side face and the peripheral area is not patterned due to being covered by the protective layer and still remains on the base material to form a strengthening layer; wherein the step of patterning the conductive layer comprises the steps of pressing a dry film, exposing, developing, etching and removing the dry film, and the protective layer is removed in the step of removing the dry film.
Description
technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and a preparation method thereof. Background technique [0002] In the preparation process of circuit boards (especially ultra-thin circuit boards with a thickness less than or equal to 40 microns), the conductive layer on the substrate layer is located on the substrate layer after lamination, exposure, development and etching. The conductive layer at the edge is etched away to expose the substrate layer. Therefore, circuit boards are prone to problems of board cracking and board breakage due to insufficient board edge rigidity. In addition, the substrate layer exposed by the edge of the circuit board is prone to debris, and the debris will cause problems such as line pollution and scratches after falling, and the overall yield rate will be lost. Contents of the invention [0003] The present invention provides a kind of preparation method of circuit bo...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K1/02H05K3/00H05K3/02
CPCH05K1/02H05K1/0296H05K3/00H05K3/027
Inventor 吴政谊林宏建
Owner QI DING TECHNOLOGY QINHUANGDAO CO LTD