High heat dissipation type printed circuit board and automobile heat dissipation system

A printed circuit board, high heat dissipation technology, applied in the direction of printed circuit, printed circuit, circuit heating device, etc., can solve the problems of unfavorable use, increase the occupied area of ​​high-power devices, etc., achieve increased heat dissipation capacity, good heat dissipation performance, and avoid The effect of occupied area

Pending Publication Date: 2022-05-17
工业和信息化部电子第五研究所华东分所
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this heat dissipation structure will increase the spacing between the pads of high-power devices to avoid contact with the heat-dissipating copper block, forcing an additional increase in the occupied area of ​​high-power devices, which is not conducive to the use in high-density situations

Method used

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  • High heat dissipation type printed circuit board and automobile heat dissipation system
  • High heat dissipation type printed circuit board and automobile heat dissipation system
  • High heat dissipation type printed circuit board and automobile heat dissipation system

Examples

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Embodiment Construction

[0031] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0032] The embodiment of the present invention provides a high heat dissipation printed circuit board. see figure 1 , the high heat dissipation printed circuit board includes: a multilayer circuit board 10, a heat dissipation block 20, a laminate of an outer circuit layer 106 and a first insulating adhesive layer 105, and a heat source device 30; the multilayer circuit board 10 is provided with a second A through hole 10A; the heat dissipation block 20 is located in the first through hole 10A; the first insulatin...

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Abstract

The invention discloses a high heat dissipation type printed circuit board and an automobile heat dissipation system. The high heat dissipation type printed circuit board comprises a multi-layer circuit board, a heat dissipation block, a laminated layer of an outer circuit layer and a first insulating bonding layer, and a heat source device, the multilayer circuit board is provided with a first through hole; the heat dissipation block is located in the first through hole; the first insulating bonding layer is located on the surface, adjacent to the heat source device, of the multi-layer circuit board; the outer circuit layer is located on the surface, away from the multilayer circuit board, of the first insulating bonding layer; the heat source device is located on the surface, away from the first insulating bonding layer, of the outer circuit layer; the orthographic projection of the heat dissipation block on the multilayer circuit board covers the orthographic projection of the heat source device on the multilayer circuit board. According to the technical scheme provided by the embodiment of the invention, the printed circuit board with good heat dissipation performance is realized on the basis of not increasing the size of the heat source device.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of printed circuit boards, in particular to a high heat dissipation printed circuit board and an automobile heat dissipation system. Background technique [0002] Printed circuit boards are printed circuit boards, also known as printed circuit boards, printed circuit boards, circuit boards for short, with insulating boards as the base material, cut to a certain size, with at least one conductive pattern attached to it, and holes (such as Component holes, fastening holes, metallization holes, etc.), used to replace the chassis of the previous electronic components and realize the interconnection between electronic components. Because this kind of board is made by electronic printing, it is called "printed" circuit board; according to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0204H05K1/021H05K2201/10416
Inventor 汪洋李晓倩杨永兴饶丹丹洪绍龙
Owner 工业和信息化部电子第五研究所华东分所
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