Back drilling manufacturing method for improving thickness out-of-tolerance of laminated plate
A production method and technology of laminated boards, which are applied in manufacturing computing systems, printed circuit manufacturing, printed circuits, etc., can solve the problems of easy drilling through the thinnest part of the board, back-drilling open circuits, etc., and achieve the effect of reducing the risk of open circuits
Active Publication Date: 2022-05-24
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0012] The technical problem to be solved by the present invention is to provide a back-drilling manufacturing method for improving the thickness tolerance of the laminated plate, aiming to solve the problem that the length of the back-drilling stub is set according to a fixed value. It is easy to be drilled through, resulting in the problem of back drilling open circuit
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[0041] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and there...
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The invention is suitable for the field of printed circuit board back drilling processing, and provides a back drilling manufacturing method for improving the thickness out-of-tolerance of a laminated plate. According to the backdrill manufacturing method, the front plate thickness of the backdrill is fully measured, the plate with the maximum plate thickness range is found out, a first piece is sliced and manufactured, slice values (slice plate thickness and stub length) at the position with the maximum slice plate thickness and the position with the thinnest slice plate thickness are measured, the ratio of stub length difference to the slice plate thickness range is calculated, modeling is carried out, and subsequent backdrill slice data are obtained according to the actually measured plate thickness. And a stub length control standard is set for the filling model according to model data, so that the open circuit risk caused by drilling through of the back drill can be reduced.
Description
technical field [0001] The invention belongs to the field of back-drilling processing of printed circuit boards, and particularly relates to a back-drilling manufacturing method for improving the thickness tolerance of a laminated board. Background technique [0002] Back-drilling of printed circuit boards is actually a special kind of depth-controlled drilling. In the production of multi-layer boards, we need to drill out the layers that affect the signal through secondary drilling. The production example is used to explain the back drilling process; [0003] 1. Requirements: back drill L16-4 layer, inner layer hole copper connects the 16th layer to the 4th layer; [0004] 2. The specific production method [0005] 1) Pre-process; [0006] 2) External drilling: drilling through holes (one drilling); [0007] 3) Electroplating: The first layer is directly connected to the 12th layer by copper plating on the hole wall; [0008] 4) Back-drilling: The customer requires the...
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K3/0005Y02P90/30
Inventor 莫崇明吴益平韩勇军
Owner SHENZHEN SUNTAK MULTILAYER PCB