43results about How to "Reduced risk of open circuit" patented technology

The invention discloses an OLED display panel and an OLED display device with the OLED display panel, and relates to the technical field of electroluminescent display. The problems that in the box alignment process of an existing top emitting type OLED display panel, pressure is too large, and an auxiliary electrode and a cathode are prone to being in a short circuit are solved. The OLED display panel comprises an array substrate and a color film substrate, the array substrate is covered with the cathode, the auxiliary electrode is formed on the color film substrate, a contact structure arranged between the color film substrate and the array substrate is further included, the contact structure enables the cathode and the auxiliary electrode to be electrically connected, and the area of the contact position of the contact structure and the array substrate is larger than or equal to the area of the contact position of the auxiliary electrode and the contact structure. The LED display device with the OLED display panel is further provided.

An electronic control unit comprises: an injection-molded supporting structure (4) for forming a cavity therein; a circuit board (11) mounted on the supporting structure; at least two electrically conductive members (20,21) combined with the supporting structure (4) during molding the supporting structure (4), wherein one end of the electrically conductive member is connected with the circuit board (11) and another end extends into the cavity (17); at least two flexible conductors (22,23), each flexible conductor comprising a corresponding insulation outer layer, wherein the flexible conductors (22,23) are combined with the supporting structure (4) when molding the supporting structure (4) and the ends of the flexible conductor (22,23) extend into the cavity (17) and permanently electrically connected with the conductive members (20,21) and the connection position of the flexible conductors (22,23) and the conductive members (20,21) is covered and sealed by a water-proof insulation material. The water intake risk of the electronic control unit is reduced and the member short circuit is prevented.

The invention belongs to a radio receiving system, and specifically provides a large-scale and highly integrated array receiving module working in millimeter wave and submillimeter wave frequency bands and a receiver integrated by the module. This invention breaks through the limitations of the original splicing technology, and realizes a larger-scale, higher-integrated array, which can significantly improve the overall uniformity and reliability, and the equipment can easily realize the expansion of functions. The sub-array of the array receiver is composed of N two-dimensional arrays with the same isosceles trapezoidal profile, so the process difficulty can be limited to the sub-array level, and an array N times the size of the sub-array can be realized without significantly increasing the technical difficulty .

The present invention provides a winding coil inspection method, device, cooking utensil, and readable storage medium, wherein the winding coil inspection method includes: determining a load signal of the winding coil in a short-circuit state, denoting it as a first preset threshold, and / Or determine the load signal of the winding coil in the open circuit state, and record it as the second preset threshold; after the winding coil is connected to the power supply signal, the real-time load signal of the winding coil is detected according to the preset period; Set the magnitude relationship between the thresholds to determine whether the winding coil is short-circuited, and / or determine whether the winding coil is open-circuited according to the magnitude relationship between the real-time load signal and the second preset threshold. Through the technical scheme of the present invention, the accuracy of judging the working state of the winding coil is improved, the possibility of failure of the cooking utensil caused by the load of the winding coil is reduced, and the safety of the cooking utensil is improved.

The present invention discloses a novel line temperature transmission device used for leading the current of the secondary winding of a CT (current transformer) to a heating resistor loop in line temperature measurement of the power transformer. The device includes a current acquisition module for acquiring the current of the secondary winding of the CT, a control circuit and an alternating-current constant current source circuit for leading output current to the heating resistor loop; the control circuit comprises a central processing unit and a liquid crystal display module; the alternating-current constant current source circuit is connected with the central processing unit through a serial communication circuit; the current acquisition module is connected with the central processing unit; and the liquid crystal display module is connected with the central processing unit. According to the novel line temperature transmission device of the invention, a current acquisition sensor is adopted to acquire the current of the secondary winding; the central processing unit processes acquired current data and communicates with the alternating-current constant current source circuit so as to control the magnitude of output current, so that the output current of the alternating-current constant current source circuit and acquired input current can be synchronous and consistent, and therefore, the risk of the open circuiting of the secondary winding of the CT can be lowered, and the stability of a transformer system can be improved.

The invention relates to a touch panel and electronic equipment. The touch panel includes: a substrate having a touch area and first and second binding areas located outside the touch area; a first touch layer extending from the touch area to the first binding area; the second touch layer extends from the touch area to the second binding area; the first conductive grid is set on the surface of the substrate away from the second touch layer, and the first conductive grid is on the substrate The projection on the surface for setting the second touch layer is located between the touch area and the second binding area; the first auxiliary lead is arranged on the substrate and electrically connected to the first conductive grid, the first There are at least two first electrical connection points between the auxiliary lead wire and the first conductive grid, and the part of the first auxiliary lead wire located between the two first electrical connection points is electrically connected. When the touch panel of the present invention is in use, when the grid lines between the two first connection points are disconnected, the current can pass through the first auxiliary leads, thereby avoiding the disconnection of the first conductive grid.

A micromechanical inclination sensor has different two silicon blocks, two parallel strain silicon beams respectivelly linked to said silicon blocks, and a glass substrate with a step. Two strain silicon beams have 4 symmetrically crossed voltage-sensitive resistors to form a differentiating output for higher sensitivity. One silicon block at one end of strain silicon beam is as a free end and anothee silicon block at another end of strain silicon beam is as fixed end linked to the step surface of glass subtrate. Its advantages are simple structure and high resistance to lateral impact and lateral coupled interference.

The invention relates to an encapsulated conducting structure for a semiconductor substrate and the forming method thereof. The encapsulated conducting structure consists of a under bump metal layer covering the liner of the semiconductor substrate, at least one auxiliary part is arranged on the under bump metal layer, and then a bump metal layer is covered, and finally a bump is arranged on a bump conducting layer. Thereby, the bump can electrically connect with the lining of the semiconductor substrate by the under bump metal layer and the bump conducting layer, and provide better connecting buffer capacity and conduction property.

The invention provides a thin film transistor and a manufacturing method thereof, a display panel and a display device. The thin film transistor comprises a first grid electrode, a source electrode and a drain electrode, which are arranged on a substrate and on the same layer, wherein a first gap is formed between the source electrode and the first grid electrode, and a second gap is formed between the drain electrode and the first grid electrode; a grid insulation layer covered on the first grid electrode; and a semiconductor layer covered on the source electrode, the grid insulation layer and the drain electrode and filling the first gap and the second gap. Therefore, the technological process of the bigrid thin film transistor is simplified, and product yield rate is improved.