43results about How to "Reduced risk of open circuit" patented technology

The invention discloses an inductance element. The inductance element comprises a magnetic core, a flat coil wound on a center pillar of the magnetic core and magnetic plastic package layers with which the magnetic core and the flat coil are coated, wherein two electrodes connected with two leading-out ends of the flat coil are exposed out of the magnetic plastic package layers; the flat coil is configured in such a manner that the width direction of a flat wire of the flat coil is perpendicular to the axial direction of the center pillar of the magnetic core; the flat wire is laminated layerby layer in the axial direction of the center pillar. Moreover, the invention further discloses a manufacturing method of the inductance element. According to the winding mode of the flat coil of theinductance element disclosed by the invention, the height of the product can be reduced under the condition of same DCR, so that the product is thinner.

The invention relates to a special-purpose low temperature solidification silver migration resistance laser etching conductive silver paste for a handset touch screen and a preparation method thereof. The conductive silver paste mainly comprises silver powder content 40-75%, high-molecular carrier content 20-50% and additive content 3-15%. The preparation method of the conductive silver paste comprises steps of high-molecular resin carrier preparation, conductive silver paste preparation and conductive silver paste post-treatment. The conductive silver paste has excellent silver migration resistance capability, the silver migration rate under the wet environment is greatly reduced, the conductive silver paste has excellent laser etching performance, intelligible patterns with line-width / line-space of 30mum / 30mum can be acquired through etching, the silver paste has excellent adhesive force on PET, ITO films, ITO glass and common glass, pencil hardness is above 4H, a lowest block resistance value can reach 20mohm / square@1mil, and the silver paste has excellent compatibility with insulation oil ink and a peelable blue plastic protective layer. The conductive silver paste molded through sintering under the low temperature is advantaged in that production cost is low, energy resources are saved, and the conductive silver paste without halogen is further environmental friendly.

The invention relates to a special ultralow temperature cured laser etching conductive silver paste for a mobile phone touch screen. The conductive silver paste mainly comprises the following components: 40%-75% of a conductive function phase, 6-15% of macromolecule resin, 15-35% of a solvent and 3-15% of an additive. The preparation of the silver paste comprises the steps of macromolecule regioncarrier preparation, conductive silver paste preparation and conductive silver paste post-processing. The conductive silver paste can be completely cured under the condition of an ultralow temperatureof 80-110 DEG C, the temperature is reduced by 20-50 DEG C compared with a curing condition of 130 DEG C of the existing conductive silver paste, and shrinkage, folding and deformation of a substratemembrane material during high-temperature curing are reduced. The paste has excellent laser etching performance, and a clear pattern with the line width / line spacing being 30 microns / 30 microns can be etched; the paste has good adhesion on PET, an ITO film, a silver nanowire conductive film, TIO glass and ordinary glass, the pencil hardness is above 2H, and the square resistance can reach up to 20m[Omega] / square@1mil. In addition, the conductive silver paste is sintered and molded at an ultralow temperature, low in production cost, energy-saving and free of halogen, thereby being an environment-friendly product.

The invention disclose a flexible touch display panel and a flexible touch display device. The flexible touch display panel comprises flexible array base boards, a display device layer, a thin film packaging layer, and a touch electrode layer. The flexible array base board comprises a flexible bottom board and an organic layer arranged on the flexible bottom board. The touch electrode layer comprises a first touch electrode and a first touch signal wire. The first touch signal wire electrically connects the first touch electrode with a flexible circuit board or an integrated circuit. In the perspective of folding, the display panel comprises a folding area and a non-folding area. In the perspective of display, the display panel comprises a display area and a frame area surrounding the display area. An organic layer of at least one layer of flexible array base board has a groove. The groove is in the frame area of the display panel. At least one groove is arranged in the folding area. The groove is internally provided with the first touch signal wire. According to the flexible touch display panel and the flexible touch display device, the frame is provided with the groove, the first touch signal wire is arranged in the groove, so as to lower the circuit break risk of the touch signal wire.

The invention relates to a COA array substrate, a preparation method thereof and a display device. The COA array substrate comprises a TFT array and a graphical colored filter layer pattern and is characterized in that the TFT array is arranged on a substrate; the colored filter layer pattern is arranged above the TFT array; the colored filter layer pattern is excavated in a gate line area and isconnected and overlaps in a data line area; DBS public electrode wires are parallelly arranged above a data line; the grid line area is provided with at least one ITO connecting wire which extends along a grid line direction and connects the two adjacent DBS public electrode wires, and each ITO connecting wire is an ITO connecting wire extending along the bottom of the boundary slope of the colored filter layer pattern. The COA array substrate, the preparation method thereof and the display device have the advantages that the ITO connecting wire is arranged at the bottom end of boundary slopeof the colored filter layer pattern, residual boundary terrain can be easily formed by using ITO, stable film forming is achieved, and conductor impedance is lowered; meanwhile, crossing of the ITO connecting wire and metal wires is avoided, and disconnection risk is lowered.

The invention relates to an end shield current sampling device suitable for an insulated online monitoring system of a high-voltage capacitor bushing and aims to solve the problem of low grounding reliability of the conventional sampling device. The sampling device comprises a spring clamp 5, a metal lead wire 6, a metal rod 11, a current transformer 7, a metal shell 3 of the current transformer 7, a metal cover 4 and a spring clamp 12, wherein in the grounding route of an end shield, an end shield 2, the metal spring clamp 5, the metal lead wire 6, the metal rod 11, the metal spring clamp 12, the metal cover 4, the metal shell 3 of the current transformer 7 and an end shield shell 1 are connected in turn; and in the entire route, spring pressure welding, tin soldering and threaded connection modes are adopted and contact is reliable. The entire device has small size, short grounding route and high end shield grounding reliability.

Embodiments of the invention disclose a display device and a preparation method thereof. The display device comprises a screen body and a first supporting layer, wherein the screen body comprises a display area and a non-display area outside the display area; the non-display area comprises a bent part and a bent extension part; the first support layer is located above the display area and is located between the display area and the bent extension part; the first supporting layer is provided with a first part overlapped with the display area and a part of the non-display area and a second partoverlapped with the bent part; and the second part is bent or a part is cut off from the side, close to the bent part, of the second part. The first supporting layer is improved, so that interferencebetween the screen body and the edge of the first supporting layerduring bending of the screen body is avoided, the stress concentration is relieved, the open circuit risk of the screen body is lowered, and the display effect of the screen body is improved.

The invention provides an array substrate, a fabrication method thereof and a display device. By improving a structure of a thin film transistor, the overlapped regional area between a data line and agate line can be reduced, the unfavorable problem of display such as crosstalk and flicker caused by overlapping of the data line and the gate line is effectively improved, and the risk that the dataline is open can be effectively reduced. The array substrate comprises a substrate, a gate line, a data line and a thin film transistor, wherein the gate line and the data line are arranged above thesubstrate in a staggered way, the thin film transistor comprises a gate, an active layer, a source and a drain, the active layer is arranged at one side, far away from the substrate, of the gate, thesource and the drain are arranged at one side, far away from the substrate, of the active layer, the gate is a part of the gate line, the source is a part of the data line, and at least one part of region of the source is arranged in a region where positive projections of the data line and the gate line on the substrate are overlapped.

The invention discloses a touch screen and a display screen. The touch screen comprises a substrate, a first electric conduction layer, an insulation layer and a second electric conduction layer, wherein the first electric conduction layer is positioned on the surface of the substrate and comprises a first metal electrode and a second metal electrode, and the first metal electrode and the second metal electrode are mutually insulated; the second metal electrode comprises two first sub-patterns which are independently arranged on two sides of the first metal electrode; the insulation layer is arranged on the first electric conduction layer; the second electric conduction layer is arranged on the first electric conduction layer and the insulation layer and comprises a third metal electrode;the third metal electrode is connected with two first sub-patterns through the insulation layer; a first sub-pattern in the first metal electrode and the second metal electrode form a touch driving electrode; and the other first sub-pattern forms a touch induction electrode. Through the above way, impedance can be effectively lowered, and a risk of open circuit is reduced.

The invention relates to an encapsulated conducting structure for a semiconductor substrate and the forming method thereof. The encapsulated conducting structure consists of a under bump metal layer covering the liner of the semiconductor substrate, at least one auxiliary part is arranged on the under bump metal layer, and then a bump metal layer is covered, and finally a bump is arranged on a bump conducting layer. Thereby, the bump can electrically connect with the lining of the semiconductor substrate by the under bump metal layer and the bump conducting layer, and provide better connecting buffer capacity and conduction property.

The invention belongs to the field of organic electroluminescence. The organic electroluminescence device comprises a first base plate, a second base plate, a plurality of lighting units, a non-lighting area corresponding to each lighting unit, light absorbing layers and conductive layers, wherein the light absorbing layers and the conductive layers are overlapped; the conductive layers are in contact connection with second conductive layers in the lighting units, so as to improve the conductive performance of a second electrode layer and lower down IR voltage drop; the light absorbing layers are arranged at the non-lighting areas and can be used for effectively reducing reflecting light of a first electrode layer, and as a result, the influence of the environmental light on the display effect can be effectively reduced. The preparation method of the organic electroluminescence device comprises the following steps: preparing the light absorbing layers, the conductive layers and the lighting units on the second base plate; buckling the first base plate on the lighting units for packing. According to the device and method, the second electrode layer of the lighting units can be directly prepared to the conductive layers and can be effectively clung to the second electrode layers, thus the risk caused by disconnection can be reduced, and the connection reliability can be improved; meanwhile, the double-board process is carried out for preparing, and therefore, the working hours can be effectively decreased, and as a result, the production efficiency can be raised.

The invention discloses an open circuit protection device and method for a secondary circuit of a current transformer, and the device comprises a housing, a monitoring module, a relay, and a voltage sensor, wherein the monitoring module, the relay and the voltage sensor are packaged in the housing, and a contact of the relay and the voltage sensor are in parallel connection with a secondary circuit; a signal input end of the monitoring module is connected with the signal line of the voltage sensor, and a high-level output end of the monitoring module is connected with the coil of the relay. The monitoring module, the relay and other elements are packaged in the shell, the voltage sensor, the relay and the like are connected to the secondary circuit in parallel inside the shell, and once the monitoring module finds that the secondary circuit is open, the contact of the relay is closed, so that a protection device similar to an air switch is obtained; the device is opposite to an air switch in principle, the air switch is disconnected when a loop is short-circuited, and the device is short-circuited when a secondary loop is disconnected.

The invention provides a thin film transistor and a manufacturing method thereof, a display panel and a display device. The thin film transistor comprises a first grid electrode, a source electrode and a drain electrode, which are arranged on a substrate and on the same layer, wherein a first gap is formed between the source electrode and the first grid electrode, and a second gap is formed between the drain electrode and the first grid electrode; a grid insulation layer covered on the first grid electrode; and a semiconductor layer covered on the source electrode, the grid insulation layer and the drain electrode and filling the first gap and the second gap. Therefore, the technological process of the bigrid thin film transistor is simplified, and product yield rate is improved.

Disclosed are a device and a method for cleaning via-hole surface of a ceramic raw belt of a stacked coil component. The device comprises a ceramic raw belt feeding part, a ceramic raw belt discharge part, a running guide rail and a carrier, wherein the carrier is driven by a power part to progress from the ceramic raw belt feeding part to the ceramic raw belt discharge part along the running guide rail, dust or scraps are attached around via holes of the ceramic raw belt, a rolling shaft with a brush is arranged above the running guide rail, and the brush contacts with the surface of the ceramic raw belt conveyed on the carrier and cleans the dust or the scraps attached around the via holes of the progressing ceramic raw belt conveyed on the carrier out of the surface of the ceramic raw belt. The method for cleaning the via-hole surface of the ceramic raw belt includes steps of manufacturing the rolling shaft with the brush, assembling the rolling shaft, placing the ceramic raw belt onto the carrier, and cleaning the dust or the scraps on the surface of the ceramic raw belt by the brush. The device and the method for cleaning the via-hole surface of the ceramic raw belt can effectively overcome defect of unreliable electrode connection caused by poor hole filling effect or line breakage of electrodes, remarkably reduce risk in open circuits among stacked coils, realize equipment cleaning automation and evidently improve cleaning efficiency.

The invention provides a flexible circuit board for a display panel, an assembly thereof, and a soldering method thereof. The flexible circuit board assembly comprises a flexible circuit board and a backlight module electrically connected with the flexible circuit board by soldering, wherein the flexible circuit board includes a flexible circuit board body; a pad is arranged on the flexible circuit board body; a tin passing groove is arranged in the pad; the backlight module comprises a backlight module body and a pin disposed on the backlight module body, and the pin is electrically connectedto the pad by tin melted from the tin passing groove. The tin coming-out area in the case of hot pressure welding is increased, the open circuit risk is thus reduced, the welding quality requirementsare met, the product yield is increased, manpower and material resources are reduced, and the manufacturing cost is further reduced.

The invention provides an image sensor anti-shake assembly, a camera device and electronic equipment, the image sensor anti-shake assembly comprises a fixed assembly, a rotating assembly, a movable assembly and a driving assembly, the fixed assembly comprises a base, a cover shell and a first circuit board; the rotating assembly comprises a rotating platform, a second circuit board and an image sensor; the movable assembly is connected with the fixed assembly and the rotating assembly, so that the rotating assembly is axially fixed, and when the driving assembly drives the rotating assembly to move, the rotating assembly can only rotate relative to the fixed assembly and cannot move. The driving assembly comprises a coil and a permanent magnet which are opposite one by one, the coil can generate a magnetic field after being electrified, the permanent magnet moves relative to the coil under the influence of the magnetic field of the coil so as to drive the rotating assembly to rotate along a first plane relative to the fixed assembly through the movable assembly, and the first plane is a plane perpendicular to the optical axis of light emitted into the image sensor.

The invention relates to a photomask, a touch module, a preparation method of the touch module, and electronic equipment. The photomask comprises a light blocking area, a light transmitting area and apartial light transmitting area, wherein the partial light transmitting area protrudes out of the edge of the light blocking area to allow partial ultraviolet transmission, the partial light transmitting area comprises a first partial light transmitting area and a second partial light transmitting area, the first partial light transmitting area is positioned on the edge of the light blocking area, the ultraviolet transmittance of the first partial light transmitting area is equal everywhere, the second partial light transmitting area is positioned on one side, far away from the light blockingarea, of the first partial light transmitting area, and has gradually-changed ultraviolet transmittance, the partial light transmitting area enables exposure energy to be small, only the dry film onthe surface layer is developed when the dry film is developed, the first partial light transmitting area is close to the light blocking area and forms smooth transition under the erosion of a developing solution, the second partial light transmitting area is far away from the light blocking area and forms an opening so as to facilitate subsequent etching, and a via hole and an ITO circuit in smooth transition are formed during etching, so that the phenomena of lateral etching and excessive etching are improved, and the visual effect and the product yield are improved.

The invention provides a system and a method for monitoring the internal resistance of a direct-current power supply valve-regulated lead-acid storage battery pack, and the system comprises the steps: introducing a switch control pair, carrying out the instantaneous direct-current discharge through the opening and closing of an MOS (Metal Oxide Semiconductor) tube, respectively collecting the voltages when the MOS tube is switched on and switched off, and calculating the internal resistance through the ratio of the voltage drop at the two ends of a storage battery to the discharge current. The internal resistance of each storage battery of the storage battery pack is monitored, which is of great significance for reducing the open circuit risk caused by further deterioration of the deteriorated storage battery, and a beneficial reference basis is provided for substation operation and maintenance personnel to prejudge the performance of the whole storage battery pack according to the monitored internal resistance value of the storage battery. Operation and maintenance personnel of the transformer substation can activate the storage battery pack or replace the degraded storage battery in a targeted manner according to the internal resistance monitoring value of each storage battery in the storage battery pack, so that a guarantee is provided for reliable power supply of the storage battery pack, and remarkable social and economic benefits are achieved.

The present invention discloses a novel line temperature transmission device used for leading the current of the secondary winding of a CT (current transformer) to a heating resistor loop in line temperature measurement of the power transformer. The device includes a current acquisition module for acquiring the current of the secondary winding of the CT, a control circuit and an alternating-current constant current source circuit for leading output current to the heating resistor loop; the control circuit comprises a central processing unit and a liquid crystal display module; the alternating-current constant current source circuit is connected with the central processing unit through a serial communication circuit; the current acquisition module is connected with the central processing unit; and the liquid crystal display module is connected with the central processing unit. According to the novel line temperature transmission device of the invention, a current acquisition sensor is adopted to acquire the current of the secondary winding; the central processing unit processes acquired current data and communicates with the alternating-current constant current source circuit so as to control the magnitude of output current, so that the output current of the alternating-current constant current source circuit and acquired input current can be synchronous and consistent, and therefore, the risk of the open circuiting of the secondary winding of the CT can be lowered, and the stability of a transformer system can be improved.

The invention relates to a touch panel and electronic equipment. The touch panel includes: a substrate having a touch area and first and second binding areas located outside the touch area; a first touch layer extending from the touch area to the first binding area; the second touch layer extends from the touch area to the second binding area; the first conductive grid is set on the surface of the substrate away from the second touch layer, and the first conductive grid is on the substrate The projection on the surface for setting the second touch layer is located between the touch area and the second binding area; the first auxiliary lead is arranged on the substrate and electrically connected to the first conductive grid, the first There are at least two first electrical connection points between the auxiliary lead wire and the first conductive grid, and the part of the first auxiliary lead wire located between the two first electrical connection points is electrically connected. When the touch panel of the present invention is in use, when the grid lines between the two first connection points are disconnected, the current can pass through the first auxiliary leads, thereby avoiding the disconnection of the first conductive grid.

A micromechanical inclination sensor has different two silicon blocks, two parallel strain silicon beams respectivelly linked to said silicon blocks, and a glass substrate with a step. Two strain silicon beams have 4 symmetrically crossed voltage-sensitive resistors to form a differentiating output for higher sensitivity. One silicon block at one end of strain silicon beam is as a free end and anothee silicon block at another end of strain silicon beam is as fixed end linked to the step surface of glass subtrate. Its advantages are simple structure and high resistance to lateral impact and lateral coupled interference.

The invention discloses an online discrimination method for an open-circuit battery in a battery pack. The method comprises the steps of enabling a pulse power supply to be connected to each single battery in the battery pack in a time-sharing manner, not loading the pulse power supply to a certain single battery when the pulse power supply is connected to the single battery, and detecting the static voltage Vj of the single battery; applying a pulse power supply to the single battery, and detecting the dynamic voltage Vd of the single battery; detecting a flow value I0 when the pulse power supply is loaded; calculating the internal resistance Ri of the single battery; if the Ri is greater than four times of the standard internal resistance of the single battery, the single battery being seriously deteriorated, and if the Ri is greater than 20 times of the standard internal resistance of the single battery, the single battery being judged as a battery open circuit. According to the discrimination method, the pulse source is used for successively and circularly detecting each single battery in the battery pack, whether the storage battery is open-circuited can be detected in real time, and the open-circuit risk of the storage battery is reduced. And time and labor are saved, and potential accidents are eliminated.

The invention relates to a double-interface module electrical connection material and its preparation method and application, belonging to the technical field of communication electronics. The electrical connection material of the dual-interface module of the present invention is a mixture of alloy solder paste and volume-expandable polymer microspheres after heating; the mixing mass ratio of alloy solder paste and volume-expandable polymer microspheres after heating is 20: (0.1‑20). The application of the electrical connection material of the dual-interface module is to remove the volatile solvent in the electrical connection material of the dual-interface module, and then apply it to the via hole for filling, forming bumps outside the via hole, and the antenna Realize butt welding conduction with the module. The electrical connection material for the double-interface module of the invention realizes the butt-welding conduction between the antenna and the module, and improves the rate of yield; the invention also provides a simple and easy preparation method and application.