43results about How to "Reduced risk of open circuit" patented technology

The invention discloses an inductance element. The inductance element comprises a magnetic core, a flat coil wound on a center pillar of the magnetic core and magnetic plastic package layers with which the magnetic core and the flat coil are coated, wherein two electrodes connected with two leading-out ends of the flat coil are exposed out of the magnetic plastic package layers; the flat coil is configured in such a manner that the width direction of a flat wire of the flat coil is perpendicular to the axial direction of the center pillar of the magnetic core; the flat wire is laminated layerby layer in the axial direction of the center pillar. Moreover, the invention further discloses a manufacturing method of the inductance element. According to the winding mode of the flat coil of theinductance element disclosed by the invention, the height of the product can be reduced under the condition of same DCR, so that the product is thinner.

The invention relates to a COA array substrate, a preparation method thereof and a display device. The COA array substrate comprises a TFT array and a graphical colored filter layer pattern and is characterized in that the TFT array is arranged on a substrate; the colored filter layer pattern is arranged above the TFT array; the colored filter layer pattern is excavated in a gate line area and isconnected and overlaps in a data line area; DBS public electrode wires are parallelly arranged above a data line; the grid line area is provided with at least one ITO connecting wire which extends along a grid line direction and connects the two adjacent DBS public electrode wires, and each ITO connecting wire is an ITO connecting wire extending along the bottom of the boundary slope of the colored filter layer pattern. The COA array substrate, the preparation method thereof and the display device have the advantages that the ITO connecting wire is arranged at the bottom end of boundary slopeof the colored filter layer pattern, residual boundary terrain can be easily formed by using ITO, stable film forming is achieved, and conductor impedance is lowered; meanwhile, crossing of the ITO connecting wire and metal wires is avoided, and disconnection risk is lowered.

The invention relates to an end shield current sampling device suitable for an insulated online monitoring system of a high-voltage capacitor bushing and aims to solve the problem of low grounding reliability of the conventional sampling device. The sampling device comprises a spring clamp 5, a metal lead wire 6, a metal rod 11, a current transformer 7, a metal shell 3 of the current transformer 7, a metal cover 4 and a spring clamp 12, wherein in the grounding route of an end shield, an end shield 2, the metal spring clamp 5, the metal lead wire 6, the metal rod 11, the metal spring clamp 12, the metal cover 4, the metal shell 3 of the current transformer 7 and an end shield shell 1 are connected in turn; and in the entire route, spring pressure welding, tin soldering and threaded connection modes are adopted and contact is reliable. The entire device has small size, short grounding route and high end shield grounding reliability.

Embodiments of the invention disclose a display device and a preparation method thereof. The display device comprises a screen body and a first supporting layer, wherein the screen body comprises a display area and a non-display area outside the display area; the non-display area comprises a bent part and a bent extension part; the first support layer is located above the display area and is located between the display area and the bent extension part; the first supporting layer is provided with a first part overlapped with the display area and a part of the non-display area and a second partoverlapped with the bent part; and the second part is bent or a part is cut off from the side, close to the bent part, of the second part. The first supporting layer is improved, so that interferencebetween the screen body and the edge of the first supporting layerduring bending of the screen body is avoided, the stress concentration is relieved, the open circuit risk of the screen body is lowered, and the display effect of the screen body is improved.

The invention belongs to a radio receiver system and particularly provides a large-scale and high-integration level array receiving module working at a millimeter or sub-millimeter wave band and a receiver integrated by the module. The integrated heterodyne array receiver breaks through the limitation of the original splicing technology, achieves the array with a larger scale and a high integration level, and can obviously improve the entire uniformity and reliability, and the device can easily achieve function expansion. The technology difficulty can be limited at a sub-array level because the sub-array of the integrated heterodyne array receiver is composed of N two-dimensional arrays with the same isosceles trapezoid outlines, and the array which is N times of the sub-array in scale can be achieved without obviously increasing the technology difficulty.

The invention relates to an encapsulated conducting structure for a semiconductor substrate and the forming method thereof. The encapsulated conducting structure consists of a under bump metal layer covering the liner of the semiconductor substrate, at least one auxiliary part is arranged on the under bump metal layer, and then a bump metal layer is covered, and finally a bump is arranged on a bump conducting layer. Thereby, the bump can electrically connect with the lining of the semiconductor substrate by the under bump metal layer and the bump conducting layer, and provide better connecting buffer capacity and conduction property.

The invention provides a thin film transistor and a manufacturing method thereof, a display panel and a display device. The thin film transistor comprises a first grid electrode, a source electrode and a drain electrode, which are arranged on a substrate and on the same layer, wherein a first gap is formed between the source electrode and the first grid electrode, and a second gap is formed between the drain electrode and the first grid electrode; a grid insulation layer covered on the first grid electrode; and a semiconductor layer covered on the source electrode, the grid insulation layer and the drain electrode and filling the first gap and the second gap. Therefore, the technological process of the bigrid thin film transistor is simplified, and product yield rate is improved.

Disclosed are a device and a method for cleaning via-hole surface of a ceramic raw belt of a stacked coil component. The device comprises a ceramic raw belt feeding part, a ceramic raw belt discharge part, a running guide rail and a carrier, wherein the carrier is driven by a power part to progress from the ceramic raw belt feeding part to the ceramic raw belt discharge part along the running guide rail, dust or scraps are attached around via holes of the ceramic raw belt, a rolling shaft with a brush is arranged above the running guide rail, and the brush contacts with the surface of the ceramic raw belt conveyed on the carrier and cleans the dust or the scraps attached around the via holes of the progressing ceramic raw belt conveyed on the carrier out of the surface of the ceramic raw belt. The method for cleaning the via-hole surface of the ceramic raw belt includes steps of manufacturing the rolling shaft with the brush, assembling the rolling shaft, placing the ceramic raw belt onto the carrier, and cleaning the dust or the scraps on the surface of the ceramic raw belt by the brush. The device and the method for cleaning the via-hole surface of the ceramic raw belt can effectively overcome defect of unreliable electrode connection caused by poor hole filling effect or line breakage of electrodes, remarkably reduce risk in open circuits among stacked coils, realize equipment cleaning automation and evidently improve cleaning efficiency.

The invention provides a flexible circuit board for a display panel, an assembly thereof, and a soldering method thereof. The flexible circuit board assembly comprises a flexible circuit board and a backlight module electrically connected with the flexible circuit board by soldering, wherein the flexible circuit board includes a flexible circuit board body; a pad is arranged on the flexible circuit board body; a tin passing groove is arranged in the pad; the backlight module comprises a backlight module body and a pin disposed on the backlight module body, and the pin is electrically connectedto the pad by tin melted from the tin passing groove. The tin coming-out area in the case of hot pressure welding is increased, the open circuit risk is thus reduced, the welding quality requirementsare met, the product yield is increased, manpower and material resources are reduced, and the manufacturing cost is further reduced.

The invention relates to a photomask, a touch module, a preparation method of the touch module, and electronic equipment. The photomask comprises a light blocking area, a light transmitting area and apartial light transmitting area, wherein the partial light transmitting area protrudes out of the edge of the light blocking area to allow partial ultraviolet transmission, the partial light transmitting area comprises a first partial light transmitting area and a second partial light transmitting area, the first partial light transmitting area is positioned on the edge of the light blocking area, the ultraviolet transmittance of the first partial light transmitting area is equal everywhere, the second partial light transmitting area is positioned on one side, far away from the light blockingarea, of the first partial light transmitting area, and has gradually-changed ultraviolet transmittance, the partial light transmitting area enables exposure energy to be small, only the dry film onthe surface layer is developed when the dry film is developed, the first partial light transmitting area is close to the light blocking area and forms smooth transition under the erosion of a developing solution, the second partial light transmitting area is far away from the light blocking area and forms an opening so as to facilitate subsequent etching, and a via hole and an ITO circuit in smooth transition are formed during etching, so that the phenomena of lateral etching and excessive etching are improved, and the visual effect and the product yield are improved.

The invention provides a system and a method for monitoring the internal resistance of a direct-current power supply valve-regulated lead-acid storage battery pack, and the system comprises the steps: introducing a switch control pair, carrying out the instantaneous direct-current discharge through the opening and closing of an MOS (Metal Oxide Semiconductor) tube, respectively collecting the voltages when the MOS tube is switched on and switched off, and calculating the internal resistance through the ratio of the voltage drop at the two ends of a storage battery to the discharge current. The internal resistance of each storage battery of the storage battery pack is monitored, which is of great significance for reducing the open circuit risk caused by further deterioration of the deteriorated storage battery, and a beneficial reference basis is provided for substation operation and maintenance personnel to prejudge the performance of the whole storage battery pack according to the monitored internal resistance value of the storage battery. Operation and maintenance personnel of the transformer substation can activate the storage battery pack or replace the degraded storage battery in a targeted manner according to the internal resistance monitoring value of each storage battery in the storage battery pack, so that a guarantee is provided for reliable power supply of the storage battery pack, and remarkable social and economic benefits are achieved.

The invention discloses an online discrimination method for an open-circuit battery in a battery pack. The method comprises the steps of enabling a pulse power supply to be connected to each single battery in the battery pack in a time-sharing manner, not loading the pulse power supply to a certain single battery when the pulse power supply is connected to the single battery, and detecting the static voltage Vj of the single battery; applying a pulse power supply to the single battery, and detecting the dynamic voltage Vd of the single battery; detecting a flow value I0 when the pulse power supply is loaded; calculating the internal resistance Ri of the single battery; if the Ri is greater than four times of the standard internal resistance of the single battery, the single battery being seriously deteriorated, and if the Ri is greater than 20 times of the standard internal resistance of the single battery, the single battery being judged as a battery open circuit. According to the discrimination method, the pulse source is used for successively and circularly detecting each single battery in the battery pack, whether the storage battery is open-circuited can be detected in real time, and the open-circuit risk of the storage battery is reduced. And time and labor are saved, and potential accidents are eliminated.