Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component

A technology of surface cleaning and laminated coils, applied in chemical instruments and methods, cleaning methods using tools, cleaning methods and utensils, etc., can solve problems such as poor hole filling effect, unreliable electrode connection of products, and electrode disconnection , to make up for the poor effect of hole filling, realize the automation of cleaning equipment, and reduce the risk

Inactive Publication Date: 2013-04-17
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The manufacturing method of laminated coil components includes laser or mechanical opening of holes on the ceramic raw tape. After the hole is opened, the residual dust or debris adheres to the surrounding of the through hole. During the subsequent printing operation, the silver around the through hole will be The slurry is easily sucked away by the negative pressure generated by the vacuum below, resulting in poor hole filling effect or electrode disconnection, resulting in the defect of unreliable electrode connection of the product

Method used

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  • Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component
  • Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component
  • Device and method for cleaning via-hole surface of ceramic raw belt of stacked coil component

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specific Embodiment approach 1

[0035] a kind of like Figure 1~3 The ceramic green tape through-hole surface cleaning device of the laminated coil components shown includes a ceramic green tape feeding part 4, a ceramic green tape unloading part 7, and a ceramic green tape feeding part 4 and a ceramic green tape unloading part. The running rail 6 between the components 7, the carrier 5 arranged on the running rail 6 for carrying the ceramic green tape 3, and the manipulator for placing the ceramic green tape 3 on the carrier 5 for carrying the ceramic green tape 3 ( figure 1 not shown in).

[0036] The stage 5 is driven by the power part and moves along the running guide rail 6 from the ceramic green tape feeding part 4 to the ceramic green tape unloading part 7. The ceramic green tape 3 is provided with through holes by laser or mechanical drilling method, and the ceramic green tape 3 Residual dust or debris adheres around the through holes on the surface. The carrier 5 is a carrier that includes a vacuu...

specific Embodiment approach 2

[0039] A method for cleaning the surface of a through-hole of a ceramic raw tape of a laminated coil component, which has the following steps in sequence:

[0040] 1) Make a circular roller 2 with an adjustable brush 1. The size of the brush 1 is adjusted according to the size of the dust and the cleaning efficiency. The bristles of the brush 1 are adjustable in size. According to the size of the dust and the cleaning efficiency be adjusted;

[0041] 2) Assemble the circular roller 2 with the adjustable brush 1 on the top of the running guide rail 6 arranged between the ceramic raw tape loading part 4 and the ceramic green tape unloading part 7, and the running guide rail 6 is set There is a stage 5 including a vacuum assembly for carrying the ceramic green tape 3, the brush 1 is in contact with the surface of the ceramic green tape 3 carried by the stage 5, and the ceramic green tape 3 is provided with a through hole by laser or mechanical drilling method, Residual dust or d...

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Abstract

Disclosed are a device and a method for cleaning via-hole surface of a ceramic raw belt of a stacked coil component. The device comprises a ceramic raw belt feeding part, a ceramic raw belt discharge part, a running guide rail and a carrier, wherein the carrier is driven by a power part to progress from the ceramic raw belt feeding part to the ceramic raw belt discharge part along the running guide rail, dust or scraps are attached around via holes of the ceramic raw belt, a rolling shaft with a brush is arranged above the running guide rail, and the brush contacts with the surface of the ceramic raw belt conveyed on the carrier and cleans the dust or the scraps attached around the via holes of the progressing ceramic raw belt conveyed on the carrier out of the surface of the ceramic raw belt. The method for cleaning the via-hole surface of the ceramic raw belt includes steps of manufacturing the rolling shaft with the brush, assembling the rolling shaft, placing the ceramic raw belt onto the carrier, and cleaning the dust or the scraps on the surface of the ceramic raw belt by the brush. The device and the method for cleaning the via-hole surface of the ceramic raw belt can effectively overcome defect of unreliable electrode connection caused by poor hole filling effect or line breakage of electrodes, remarkably reduce risk in open circuits among stacked coils, realize equipment cleaning automation and evidently improve cleaning efficiency.

Description

technical field [0001] The invention relates to laminated coil components, in particular to a device and method for cleaning the through-hole surface of a ceramic raw tape of laminated coil components. Background technique [0002] The manufacturing method of laminated coil components includes laser or mechanical opening of holes on the ceramic raw tape. After the hole is opened, the residual dust or debris adheres to the surrounding of the through hole. During the subsequent printing operation, the silver around the through hole will be The slurry is easily sucked away by the negative pressure generated by the vacuum below, resulting in poor hole filling effect or electrode disconnection, resulting in the defect of unreliable electrode connection of the product. Contents of the invention [0003] A technical problem to be solved by the present invention is to make up for the defects of the above-mentioned prior art, and provide a device for cleaning the surface of the thr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B1/02H01F41/00
Inventor 陆达富祝小清余洪学
Owner SHENZHEN SUNLORD ELECTRONICS
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