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Double-interface module electrical connection material and its preparation method and application

A technology of connecting materials and double interfaces, which is applied in the field of communication electronics, can solve the problems of low yield rate of finished products, low yield rate of products, antenna touch welding, etc., achieve the effect of reducing cost input, simple and easy preparation method, and improving yield rate

Active Publication Date: 2022-02-08
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The yield rate of the finished product prepared by traditional conductive rubber is low, while the use of ordinary solder, due to the volume shrinkage of the solder paste during the reflow process, the antenna cannot be touched and welded normally, the yield rate of the product is low, and the problem of open circuit is prone to occur

Method used

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  • Double-interface module electrical connection material and its preparation method and application
  • Double-interface module electrical connection material and its preparation method and application
  • Double-interface module electrical connection material and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0027] An electrical connection material for a dual-interface module, which is a mixture of alloy solder paste and polymer microspheres that can expand in volume after heating, wherein the alloy solder paste is tin-lead paste, and the polymer microspheres are EXpancel DU (produced by Nouryon, Japan). The mixing mass ratio of the two is 20:0.1.

[0028] The preparation method of the electrical connection material of the double-interface module comprises the following steps:

[0029] First add volatile solvent toluene to the alloy solder paste to reduce the viscosity of the solder paste, then add polymer microspheres that can expand in volume after heating, and disperse at a high speed at a stirring speed of 3500r / min to obtain the dual-interface module Electrical connection material.

[0030] Remove the volatile solvent in the connection material, and screen-print the connection material on the module with the via holes L2 and L1 with a diameter of 2 mm and a hole depth of 90 ...

Embodiment 2

[0032] A dual-interface module electrical connection material, which is a mixture of alloy solder paste and polymer microspheres that can expand in volume after heating, wherein the alloy solder paste is tin-silver-copper solder paste, and the polymer microspheres are F-190D (produced by Matsumoto, Japan) , the mixing mass ratio of the two is 20:1.

[0033] The preparation method of the electrical connection material of the double-interface module comprises the following steps:

[0034] First add volatile solvent alcohol to the alloy solder paste to reduce the viscosity of the solder paste, then add polymer microspheres that can expand in volume after heating, and disperse at a high speed at a stirring speed of 2000r / min to obtain the dual-interface module Electrical connection material.

[0035] Remove the volatile solvent in the connection material, and screen-print the connection material on the module with the via holes L2 and L1 with a diameter of 2.5 mm and a hole depth...

Embodiment 3

[0037] An electrical connection material for a dual-interface module, which is a mixture of alloy solder paste and polymer microspheres that can expand in volume after heating, wherein the alloy solder paste is tin-lead paste, and the polymer microspheres are EXpancel DU (produced by Nouryon, Japan). The mixing mass ratio of the two is 1:1.

[0038] The preparation method of the electrical connection material of the double-interface module comprises the following steps:

[0039] The polymer microspheres capable of volume expansion after heating are added to the alloy solder paste, and dispersed at a high speed at a stirring speed of 6000 r / min to obtain the electrical connection material for the dual-interface module.

[0040] On the module with via holes L2 and L1 with a diameter of 3 mm and a hole depth of 150 microns, the above-mentioned connection material is silk-screened, and after reflow at 200° C., the thickness of the solder becomes 170 microns.

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Abstract

The invention relates to a double-interface module electrical connection material and its preparation method and application, belonging to the technical field of communication electronics. The electrical connection material of the dual-interface module of the present invention is a mixture of alloy solder paste and volume-expandable polymer microspheres after heating; the mixing mass ratio of alloy solder paste and volume-expandable polymer microspheres after heating is 20: (0.1‑20). The application of the electrical connection material of the dual-interface module is to remove the volatile solvent in the electrical connection material of the dual-interface module, and then apply it to the via hole for filling, forming bumps outside the via hole, and the antenna Realize butt welding conduction with the module. The electrical connection material for the double-interface module of the invention realizes the butt-welding conduction between the antenna and the module, and improves the rate of yield; the invention also provides a simple and easy preparation method and application.

Description

technical field [0001] The invention relates to a double-interface module electrical connection material and its preparation method and application, belonging to the technical field of communication electronics. Background technique [0002] The dual-interface module can realize contact and non-contact communication at the same time. The non-contact method is mainly realized by using the radio frequency function. Therefore, when the dual-interface module realizes contactless communication, it needs to be electrically interconnected with the radio frequency antenna. transmission of data. [0003] The connection between the traditional dual-interface module and the antenna is now generally using conductive rubber or solder paste, tin sheet, etc., but these methods have their own defects, such as low yield rate, poor reliability, and low production efficiency. Such as figure 1 As shown, the non-contact pads on the chip are connected to C4 and C8 through Au wires, and C4 and C...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K11/10B23K35/02
Inventor 朱林陈长军季元鸿蔡雄辉
Owner 新恒汇电子股份有限公司
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