Integrated heterodyne array receiver of millimeter and sub-millimeter wave bands

A millimeter-wave and sub-millimeter technology, applied in the direction of electrical components, transmission systems, etc., can solve the problems of unsupported waveguide-type local oscillator distribution, bulky receiver system, lack of pairing of one-dimensional sub-arrays, etc., to reduce electrical welding Risk of point breaks, reduced difficulty, effects of improved uniformity and reliability

Inactive Publication Date: 2014-08-06
ZIJINSHAN ASTRONOMICAL OBSERVATORY CHINESE ACAD OF SCI
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Problems solved by technology

However, this method still has obvious shortcomings: one-dimensional sub-arrays lack equivalent characteristics (divided into outer sub-arrays and inner sub-arrays), so the entire array lacks symmetry, and the scalability of the array is limited; due to heat transfer and mechanical reliability The length of the one-dimensional array is restricted, which also limits the maximum number of pixels; this method does not support waveguide-type local oscillator distribution, and the local oscillator distribution has to adopt a quasi-optical method, resulting in a large receiver system that cannot Enabling compact large-scale arrays

Method used

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  • Integrated heterodyne array receiver of millimeter and sub-millimeter wave bands
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  • Integrated heterodyne array receiver of millimeter and sub-millimeter wave bands

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Embodiment 1

[0040] Embodiment 1 Millimeter wave, submillimeter wave band heterodyne array receiving module

[0041] The millimeter-wave and submillimeter-wave band heterodyne array receiving module adopts an isosceles trapezoidal columnar module with a cross-section and a base angle of 60 degrees, and is made of pure copper with gold plating. as attached figure 1 As shown, the subarray modules are layered by function. According to the order of signal transmission, the top layer is the horn antenna layer (15), which integrates 6 corrugated horn antennas (9-13). The second layer is the local oscillator distribution layer (16), which realizes the distribution of local oscillators in the 6 pixels; the third layer is the mixer circuit layer (17), which completes the frequency mixing of the input signal and the reference signal. The voltage bias required by the mixer is input through a 25-core micro-D connector (21); the fourth layer is a low-noise amplifier layer (18), which performs low-no...

Embodiment 2

[0043] Embodiment 2 Heterodyne Array Receiver in Millimeter Wave and Submillimeter Wave Bands

[0044] The millimeter-wave and submillimeter-wave band heterodyne array receivers specifically connect the input waveguide port of the heterodyne array receiving module in Embodiment 1 to a local oscillator transceiver module through pin positioning and screws, and the local oscillator transceiver module uses a corrugated horn. The antenna receives the local oscillator signal.

Embodiment 3

[0045] Embodiment 3 Millimeter wave, submillimeter wave band integrated heterodyne array receiver

[0046] as attached image 3 As shown, 6 heterodyne array receiving modules described in Embodiment 1 are selected to form a regular hexagonal outline 36-pixel integrated heterodyne array receiver (1), and the center of the regular hexagonal array is a 6-prism shaped local oscillator transceiver module (8). in the attached Figure 4 The two sub-array modules are hidden in the middle, showing the location of the local oscillator transceiver module. The local oscillator signal input ports of the six sub-array modules surround the local oscillator transceiver module (8). as attached Figure 5 As shown, the local oscillator transceiver module consists of a corrugated horn antenna (31) and 6-way power dividers (32-33). The waveguide power divider is processed on the upper surface of (33), and the waveguide circuit structure is split on the H end face of the waveguide, and the two...

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Abstract

The invention belongs to a radio receiving system, and specifically provides a large-scale and highly integrated array receiving module working in millimeter wave and submillimeter wave frequency bands and a receiver integrated by the module. This invention breaks through the limitations of the original splicing technology, and realizes a larger-scale, higher-integrated array, which can significantly improve the overall uniformity and reliability, and the equipment can easily realize the expansion of functions. The sub-array of the array receiver is composed of N two-dimensional arrays with the same isosceles trapezoidal profile, so the process difficulty can be limited to the sub-array level, and an array N times the size of the sub-array can be realized without significantly increasing the technical difficulty .

Description

technical field [0001] The invention belongs to a radio receiving system, in particular to a large-scale and highly integrated array receiver system working in millimeter wave and submillimeter wave frequency bands. Background technique [0002] Multi-pixel detection technology with spatial imaging capabilities is widely used in optical and infrared bands (such as CCD cameras). With the rapid growth of imaging requirements in fields such as astronomical observation and aerospace remote sensing, the importance of array receiver technology in microwave, millimeter wave, submillimeter wave and other bands has become increasingly prominent. [0003] According to the receiver's spectral resolution capability, array receivers are divided into two basic types: heterodyne receivers with high spectral resolution capabilities and non-coherent receivers with imaging but lack of spectral resolution capabilities. The latter only receives the strength of the signal and loses the precise ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/26
Inventor 单文磊杨戟
Owner ZIJINSHAN ASTRONOMICAL OBSERVATORY CHINESE ACAD OF SCI
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