Special ultralow temperature cured laser etching conductive silver paste for mobile phone touch screen
A technology of conductive silver paste and laser etching, which is applied in the direction of carbon-silicon compound conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of time-consuming, energy, substrate deformation, and adding materials, etc., to achieve The effects of enhanced binding, improved thixotropy, and reduced dosage
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example 1
[0032] The silver paste is prepared through three process steps of preparation of polymer resin carrier, preparation of conductive silver paste and post-treatment of conductive silver paste.
[0033] Step 1, preparation of polymer resin carrier.
[0034] First take by mass percentage the epoxy resin of 40% (relative molecular mass is 15000) mix with 60% diethylene glycol ether acetate and diethylene glycol butyl ether acetate mixed solvent, and dissolve at 70 ℃ complete; then weigh 20% polyester resin (relative molecular mass: 35,000) and mix with 80% ethylene glycol ether according to mass percentage, and dissolve completely at 70°C. Finally, the two carriers were weighed and mixed with a mass ratio of 4:1. They were mixed and stirred evenly at 70° C., and the obtained carrier had a viscosity of 6000-7000 cps. The carrier is then filtered to remove impurities on a 600-mesh stainless steel screen to obtain the final polymer resin carrier.
[0035] Step 2, preparation of cond...
example 2
[0041] The silver paste is prepared through three process steps of preparation of polymer resin carrier, preparation of conductive silver paste and post-treatment of conductive silver paste.
[0042] Step 1, preparation of polymer resin carrier
[0043] First take by mass percentage the epoxy resin of 40% (relative molecular mass is 15000) mix with 60% diethylene glycol butyl ether acetate, and dissolve completely at 70 ℃; Then take by mass percentage 40% The polyester resin (relative molecular mass is 35000) is mixed with 60% ethylene glycol ether acetate, and dissolved completely at 70°C. Finally, the two carriers were weighed and mixed with a mass ratio of 3:16, mixed and stirred evenly at 70°C, and the viscosity of the obtained carrier was 13000-15000cps, and then the carrier was filtered on a 400-mesh stainless steel screen to obtain the final Polymer resin carrier.
[0044] Step 2, preparation of conductive silver paste.
[0045] Take by weight 62% mixed silver powder...
example 3
[0050] The slurry preparation method is similar to example one and two.
[0051] The proportion of each component is: polyester resin-5.26%, epoxy resin content-4.06%, ethylene glycol ethyl ether acetate-4.12%, diethylene glycol butyl ether acetate-2.95%, DBE-7.5%, hydroxyethyl ether Base Cellulose-1.5%, Polyamide Wax-0.5%, Dibutyl Phthalate-1%, BYK-R605-0.5%, Benzyl Glycidyl Ether-2.5%, Silicone Oil-1%, Acrylate Flow Leveling agent - 0.5%, sodium dodecylsulfonate - 0.5%, mercaptothiol curing agent - 0.5%, fluorine modified surfactant - 0.5%, dodecanoic acid - 1.5%, the remaining components are mixed conductive powder .
[0052] The composition ratio of the mixed silver powder and the conductive carbon black is: micron flake silver powder-75.02%, nano-spherical silver powder-18.74%, and nano-conductive carbon black-6.24%.
[0053] Using Brookfield DV-II viscometer, using No. 28 spindle to measure at 50 rpm, the viscosity is 50000-60000cps. After printing, the thickness of t...
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