This application discloses a bonding wedge, comprising a body having a through hole extending through the body along its axis, a head of the body having an end face intersecting the inner circumferential surface of the through hole, the end face including a plurality of circumferentially uniformly distributed sector areas, each of the plurality of sector areas extending from the radially inner side of the end face intersecting the inner circumferential surface of the through hole to the radially outer side of the end face, wherein each sector area includes a plurality of first grooves parallel to its first edge, the plurality of first grooves including at least one first through groove extending from the radially outer edge of the sector area to the inner circumferential surface of the through hole.
