Unlock instant, AI-driven research and patent intelligence for your innovation.

Plate-shaped connector, double-ring serial connection piece thereof and wafer test assembly

A technology for wafer testing and connectors, which is used in the testing of single semiconductor devices, parts and instruments of electrical measuring instruments, etc., to reduce the probability of breakage and improve the yield of manufacturing.

Pending Publication Date: 2022-05-27
CHUNGHWA PRECISION TEST TECH
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiments of the present invention is to provide a board-shaped connector and its double-ring serial connection piece and chip test assembly, which can effectively improve the defects that may occur in existing chip test devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plate-shaped connector, double-ring serial connection piece thereof and wafer test assembly
  • Plate-shaped connector, double-ring serial connection piece thereof and wafer test assembly
  • Plate-shaped connector, double-ring serial connection piece thereof and wafer test assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The following are specific embodiments to illustrate the embodiments of the “board connector, its double-ring serial connection and wafer test assembly” disclosed in the present invention. Those skilled in the art can understand the present invention from the content disclosed in this specification. Advantages and Effects. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the accompanying drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a plate-shaped connector, a double-ring serial connection piece thereof and a wafer test assembly. The plate-shaped connector comprises a plurality of double-ring type serial connection pieces which are arranged at intervals and an insulating layer. Each double-ring series connection piece comprises two bearing rings, two cantilevers, two abutting columns and a bridging section, wherein the two cantilevers extend from the two bearing rings and are arranged in a coplanar mode, the two abutting columns extend from the two cantilevers in the opposite directions respectively, and the bridging section is connected with the two bearing rings. The insulating layer is connected with the bearing rings of the multiple double-ring type serial connection pieces, and the two abutting columns of each double-ring type serial connection piece protrude out of the two opposite sides of the insulating layer respectively. And each double-ring serial connection piece is propped against two plate pieces through the two propping columns of the double-ring serial connection piece. Therefore, the wafer test assembly can be easily separated from each other by adopting the plate-shaped connector, so that subsequent detection and maintenance are facilitated.

Description

technical field [0001] The invention relates to a test assembly, in particular to a plate-shaped connector, a double-ring serial connection piece and a chip test assembly. Background technique [0002] The existing chip testing device includes a testing circuit board electrically coupled to the testing machine and a signal transmission board disposed on the testing circuit board, and the signal transmission board is soldered in the existing chip testing device fixed on the test circuit board. However, during the process of soldering and fixing the signal transmission board and the test circuit board, the conventional chip testing device is easily damaged by thermal shock. In addition, the signal transmission board and the test circuit board that are welded and fixed to each other are not conducive to their own subsequent detection and maintenance. [0003] Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to researc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/04
CPCG01R31/2601G01R1/0408
Inventor 谢开杰刘兆强郑孟杰苏伟志
Owner CHUNGHWA PRECISION TEST TECH