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Polishing disk surface finishing device

A dressing device and polishing disc technology, applied in abrasive surface adjustment devices, grinding devices, grinding/polishing equipment, etc., can solve the problems of easy deformation, inability to process wafers, affecting geometric parameters, etc., and achieve the effect of repairing deformation

Pending Publication Date: 2022-06-03
SHANGHAI HANHONG PRECISION MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polishing disc is easily deformed during transportation and installation, resulting in uneven surface morphology of the polishing disc after installation, which affects the geometric parameters of polishing, and even cannot process wafers that require high TTV (silicon wafer flatness)

Method used

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  • Polishing disk surface finishing device
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Examples

Experimental program
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Effect test

Embodiment Construction

[0032] The present invention will be further described below in conjunction with the accompanying drawings.

[0033] like figure 1 , 2 As shown, a polishing disc surface conditioning device, comprising: image 3 Platform 1 shown, such as Figure 4 Column 2 shown, such as Figure 5 Beam 3 shown, such as Image 6 As shown in the positioning rod 4, such as Figure 7 The guide rod 5, guide wheel 6 and as shown Figure 8 Grinding disc 7 shown.

[0034] A rotatable polishing disc can be placed on the platform 1 . The platform is welded with medium-thickness steel plate and channel steel. Reserve in the middle of the platform The through hole 11 is convenient to pass constant temperature cooling water when grinding and polishing the disc.

[0035] The bottom end of the upright column 2 is fixed on the platform 1 by screws. The top of the column 2 is sleeved with a flange 21 , a plurality of triangular reinforcing ribs 22 are arranged between the bottom surface of the flan...

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PUM

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Abstract

The invention discloses a polishing disk surface finishing device. A polishing disk capable of rotating can be placed on a platform; the first end of the beam is connected with the top end of the stand column. The beam can rotate to any angle with the stand column as the center and then is fixedly connected. The first end of the positioning rod is fixedly connected with the second end of the beam, a plurality of guide rod mounting holes are evenly formed in the second end of the positioning rod in the length direction of the positioning rod, and each guide rod mounting hole penetrates through the positioning rod from top to bottom. The top end of the guide rod can penetrate into any guide rod mounting hole and is locked and fixed, and a guide wheel is mounted at the bottom end of the guide rod through a bearing; a positioning hole is formed in the center of the grinding disc, the diameter of the positioning hole is larger than the outer diameter of the guide wheel, after the grinding disc is placed at the to-be-ground position on the surface of the polishing disc, the guide wheel is inserted into the positioning hole in the center of the grinding disc, and after the polishing disc rotates, the grinding disc rotates with the center point of the polishing disc as the center. And the installed polishing disc can be integrally machined, and deformation of the polishing disc in the carrying and installing process can be repaired.

Description

technical field [0001] The invention relates to high-precision SIC, single-crystal silicon, sapphire and other single-sided / double-sided polishing machines in the semiconductor industry, in particular to a polishing disc surface trimming device. Background technique [0002] Single-sided / double-sided polishing machine polishing discs were previously machined on the grinder separately and then bolted to the water-cooled disc. The polishing disc is easily deformed during handling and installation, resulting in uneven topography on the surface of the polishing disc after installation, which affects the geometric parameters of polishing, and even cannot process wafers that require high TTV (silicon wafer flatness). SUMMARY OF THE INVENTION [0003] In view of the problems existing in the prior art, the present invention provides a polishing disc surface trimming device, which can process the installed polishing disc as a whole, and can repair the deformation of the polishing d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/12B24B53/095B24B37/11B24B37/27B24B37/34B24B41/02B24B57/02
CPCB24B53/12B24B53/095B24B37/11B24B37/27B24B37/34B24B41/02B24B57/02
Inventor 黄家剑贺贤汉胡烺王军
Owner SHANGHAI HANHONG PRECISION MACHINERY
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