Packaging structure for LED
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市两岸半导体科技有限公司
- Publication Date
- 2022-06-03
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the technical field of LED plant lighting and horticultural lighting, in particular to a packaging structure for LEDs. Background technique
[0002] Different wavelengths of light have different effects on plant photosynthesis, and blue and red LEDs can promote green leaf growth. The flowering result is of great help to increase the yield, but the existing LED lamp beads are flat, and after they are turned on, they are irradiated on the plants in a scattered way, and the light output is uneven, which can easily reduce the photosynthetic photon flux of the edge plants. Therefore, there is an urgent need for a packaging structure for LEDs.
[0003] The defects of the existing packaging structure are:
[0004] Patent document CN215377432U discloses a package structure for LED, including: a substrate and a pad. The substrate is provided with a power supply connection part connected to a power supply, and a pad fixing position is...